COM-HPC – Computer-on-Module for High Performance Computing

The new COM standard for High Performance Computing

The usage of standardized Computer-on-Modules in the embedded market shows a long history of success – the best example is COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005.

However today the embedded market is facing new challenges..

Applications such as artificial intelligence,  the upcoming 5G wireless standard come with enormous data hunger and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to cope with the growing embedded market demands.

Leading manufacturers in the industry, such as Kontron, have set up a new working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing -  COM-HPC - will be complementary to the existing COM Express® standard. 

Learn more about the new COM standard: COM-HPC Introduction



COM-HPC Modules

COMh-caRP Coming soon

COM HPC/Client module size A with 13th Generation Intel® Core™ Processors

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COMh-caAP New

COM HPC/Client module size A with 12th Generation Intel® Core™ Processors

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COMh-ccAS New

COM-HPC Client Size C module based on the 12th and 13th Gen Intel® Core™ S processors

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COMh-sdID New

COM-HPC®/Server with Intel® Xeon® D-2700 processor family

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COM-HPC Carrier

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