COM-HPC - COMPUTER ON MODULE For HIGH PERFORMANCE COMPUTING

COM-HPC - NEW COMPUTER ON MODULES STANDARD

HIGH PERFORMANCE COMPUTING

Data growth is unstoppable and the upcoming 5G wireless standard will accelerate it. Experts expect new digital business models that are only conceivable due to the high data transfer rates of the upcoming 5G standard. Applications such as artificial intelligence come with enormous data hunger and require the lightning-fast, algorithm-based evaluation of the huge amount of data. IoT devices, sensors and actuators, of which more are connected to the Internet every hour, continue to produce enormous amounts of data from autonomous vehicles, for example. Hundreds of signals have to be processed in fractions of a second. Many of these scenarios no longer take place in a protected high-performance computing center or in the cloud, but close to where the data originates: on mobile masts, on production lines, in warehouses, at processing plants or in autonomous vehicles, to name just a few.

 

COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005, will continue to provide a reliable and long-lasting service for traditional embedded industrial computing demands.

 

New concepts for embedded computers are required where existing standards are no longer sufficient to cope with the high volume of data and the computing power required to process this data.

 

In order to give an answer to the demanding new challenges in embedded computing the PICMG standardization committee is defining a new computer on module standard - COM-HPC for High Performance Computing. 

COM-HPC targets

COM-HPC/CLIENT AND COM-HPC/SERVER

In general COM-HPC is going to address two different use cases:

 COM-HPC/Client: embedded including graphics support
 COM-HPC/Server: server-type with focus to high ethernet bandwidth 

COM-HPC/Client

COMPUTING PERFORMANCE WITH UP TO 65W PROCESSOR TDP

 Computing performance with up to 65W processor TDP
 Up to 48 + 1 PCI Express Gen4/5 lanes
 Up to 4 graphics interfaces
 Up to 2x 25 Gb Ethernet interfaces
 Module size:
Size A: 95 x 120 mm
Size B: 120 x 120 mm
Size C: 160 x 120 mm 

 COM-HPC/Server

COMPUTING PERFORMANCE WITH UP TO 125W PROCESSOR TDP

 Computing performance with up to 125W processor TDP
 Up to 64 + 1 PCI Express Gen4/5 lanes
 No graphic interfaces
 Up to 8x 25 Gb Ethernet interfaces
 Module size:
Size D: 160 x 160 mm
Size E: 200 x 160 mm 

COM-HPC/CONNECTOR

 In order to support the future oriented pin-out definition a new connector will be introduced with 400 pins.
 The COM-HPC standard defines the use of two connectors adding up to a powerful connectivity bandwidths of 800 pins.
 5mm/10mm stack hight. 

Comparison

New COM HPC Video - watch the Details

Whitepaper

VDC Whitepaper: Computer-on-Modules Invade HPC

VDC Whitepaper: Computer-on-Modules Invade HPC

A range of industry applications face escalating demand for high-performance embedded computing. More specifically, this growing demand is for solutions built on standard ...

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PICMG - SPONSORS AND SUPPORTING COMPANIES

 

SPONSORS:

Adlink, congatec, Kontron

MEMBERS:

Adlink, Advantech, congatec, Elma Electronic, Emerson Machine Automation Solutions, Ept, Fastwel, GE Automation, HEITEC, Intel, Kontron, MEN, MSC Technologies, N.A.T., Samtec, Seco, TE Connectivity, Trenz Electronic, University Bielefeld, VersaLogic Corp. 
 

 

OFFICIAL POSITIONS:

 Chairman: Christian Eder, congatec  Editor: Stefan Milnor, Kontron
 Secretary: Dylan Lang, Samtec 

SCHEDULES:

 PICMG workgroup officially started Oct 23, 2018
 Pinout and mechanics pre release Oct 2019: done
 Specification final expected for Q1/2020
 Design guide final expected for Q2/2020 

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