COM-HPC® - NEW COMPUTER ON MODULES STANDARD

HIGH PERFORMANCE COMPUTING

Data growth is unstoppable and the upcoming 5G wireless standard will accelerate it. Experts expect new digital business models that are only conceivable due to the high data transfer rates of the upcoming 5G standard. Applications such as artificial intelligence come with enormous data hunger and require the lightning-fast, algorithm-based evaluation of the huge amount of data. IoT devices, sensors and actuators, of which more are connected to the Internet every hour, continue to produce enormous amounts of data from autonomous vehicles, for example. Hundreds of signals have to be processed in fractions of a second. Many of these scenarios no longer take place in a protected high-performance computing center or in the cloud, but close to where the data originates: on mobile masts, on production lines, in warehouses, at processing plants or in autonomous vehicles, to name just a few.

 

COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005, will continue to provide a reliable and long-lasting service for traditional embedded industrial computing demands.

 

New concepts for embedded computers are required where existing standards are no longer sufficient to cope with the high volume of data and the computing power required to process this data.

 

In order to give an answer to the demanding new challenges in embedded computing the PICMG standardization committee is defining a new computer on module standard - COM-HPC®  for High Performance Computing.


READ MORE IN THE NEW WHITEPAPER 

 

 

COM-HPC® targets

COM-HPC® /CLIENT AND COM-HPC/SERVER

In general COM-HPC®  is going to address two different use cases:

 COM-HPC® /Client: embedded including graphics support
 COM-HPC® /Server: server-type with focus to high ethernet bandwidth 

COM-HPC®/Client

COMPUTING PERFORMANCE WITH UP TO 65W PROCESSOR TDP

 Computing performance with up to 65W processor TDP
 Up to 48 + 1 PCI Express Gen4/5 lanes
 Up to 4 graphics interfaces
 Up to 2x 25 Gb Ethernet interfaces
 Module size:
Size A: 95 x 120 mm
Size B: 120 x 120 mm
Size C: 160 x 120 mm 

COM-HPC®/Server

COMPUTING PERFORMANCE WITH UP TO 125W PROCESSOR TDP

 Computing performance with up to 125W processor TDP
 Up to 64 + 1 PCI Express Gen4/5 lanes
 No graphic interfaces
 Up to 8x 25 Gb Ethernet interfaces
 Module size:
Size D: 160 x 160 mm
Size E: 200 x 160 mm 

COM-HPC®/CONNECTOR

 In order to support the future oriented pin-out definition a new connector will be introduced with 400 pins.
 The COM-HPC®  standard defines the use of two connectors adding up to a powerful connectivity bandwidths of 800 pins.
 5mm/10mm stack hight. 

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Whitepaper

COM-HPC Whitepaper

COM-HPC Whitepaper

This Whitepaper overviews the key features of the new COM-HPC® standard and Kontron’s initial COM-HPC® products, while also assessing COM Express® versus COM-HPC® and ...

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Computer-on-Modules Invade HPC

Computer-on-Modules Invade HPC

A range of industry applications face escalating demand for high-performance embedded computing. More specifically, this growing demand is for solutions built on standard ...

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PICMG - SPONSORS AND SUPPORTING COMPANIES

 

SPONSORS:

Adlink, congatec, Kontron

MEMBERS:

ADLINK, Advantech, congatec, Elma Electronic, ICC Intelligent Platforms, ept, Fastwel, GE Automation, Heitec, Intel, Kontron, Avnet Integrated, NAT, nVent, Samtec, Seco, Supermicro, TE Connectivity, Trenz Electronic, University Bielefeld, VersaLogic Corp

 

OFFICIAL POSITIONS:

 Chairman: Christian Eder, congatec  Editor: Stefan Milnor, Kontron
 Secretary: Dylan Lang, Samtec 

SCHEDULES:

  • PICMG workgroup officially started Oct 23, 2018
  • Pinout and mechanics pre-release Oct 2019: done
  • PICMG COM-HPC® Module Base Specification - Release Jan/2021
  • PICMG EeeP for COM-HPC® (Embedded EEPROM Specification) – Release Q1/2021
  • PICMG COM-HPC® Platform Management Interface – Release Q1/2021
  • PICMG COM-HPC® Carrier Design Guide – Release Q2/2021

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