COMh-sdID New
COM-HPC®/Server with Intel® Xeon® D-2700 processor family
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Specifications
- Size D form factor – 160 x 160 mm
- Intel Xeon D-2700 (formerly Ice Lake D) Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations - up to 100GbE
- Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.
The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMh-sdID
[ comh-sdid_datasheet.pdf, 1.53 MB, Apr.20.2023 ]
Manuals
COMh-sdID User Guide
[ comh-sdid_user_guide_rev1-0.pdf, 1.49 MB, Jul.04.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
White Papers
The new Standard COM-HPC – Delivering future proofed power and connectivity
[restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.
While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.
Tech Spec Sheet
COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 5.69 MB, Apr.20.2023 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Accessories
|
COMh Eval Carrier Server
HST01-0000-10-0 |
|
COMh Eval Carrier Server | more |
|
COMh Mounting Kit HXX17-0000-00-0 |
COM-HPC Universal Mounting Kit |
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