COMh-caRP

COM HPC/Client module size A with 13th Generation Intel® Core™ Processors
Specifications
  • Up to 64 GByte DDR5 memory
  • Up to 2.5Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade
Download Datasheet

The COMh-caRP is based on 13th Gen Intel® Core™ processors (former codename Raptor Lake U/P/H. They offer a significant performance increase compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture. The 13th generation is particularly well suited for connected IoT applications. A new embedded controller ensures improved availability, flexibility and system openness. The Module provides essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN), and extended temp ranges of -40C to +85C Tjmax.
All features are perfect for high-performance computing in resource-intensive and demanding areas such as networking, automation and measurement and customers profit from longterm availability

Features

Compliance COM HPC® Client 2x 400 pin connector
Dimension (H x W) 95 x 120 mm
CPU Intel® 13th Generation CoreTM family
For details see table (CPU variants) given below
Chipset lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub
Main Memory 2x DDR5 SODIMM dual channel up to 32 GByte ECC or non ECC
Graphics Controller Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K)
Ethernet Controller Intel® i226
Ethernet Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU)
Storage 2x SATA 6Gb/s (optional)
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI Express 1x 8 PCIe Gen 4.0 (Alder Lake H-Series, 35-45 W)
2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0
Optional 1x PCIe for BMC
Display DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI
USB 2x USB 4.0/ Thunderbolt TM; 2x USB 3.2; 8x USB 2.0
Serial 2x serial interface (RX/TX only)
Audio 4x Sound wire, I2S (HW option: Option HD Audio instead of 2x sound wire)
Special Features Trusted Platform Module TPM 2.0
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
BIOS AMI UEFI
Operating System Windows®10, Linux, VxWorks
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Extended temperature (planned): -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature (planned): -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

Datasheets

COMh-caRP
[ COMh-caRP_datasheet.pdf, 1.66 MB, Jan.16.2023 ]

Manuals

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]



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