COMe-bRP6 (E2)
COM Express® Basic Type 6 with 13th Generation Intel® Core™ Processors
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Specifications
Coming soon- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.
The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).
All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.
Features
| Compliance | COM Express® Basic Pin-out Type 6 |
| Dimension (H x W) | 125 x 95 mm |
| CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
| Chipset | Integrated SoC |
| Main Memory | 2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC) |
| Graphics Controller | Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors |
| Ethernet Controller | Intel® I226LM/I226IT |
| Ethernet | Up to 2.5Gb Ethernet with TSN support (depending on SKU) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA or alternatively 8x with additional PCIe Switch) 2x4 PCIe 4.0 on PEG Lanes #0-7 1x8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU) |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | High Definition Audio interface |
| Common Features | (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows®10, Linux, VxWorks (project based) |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
技术参数
COMe-bRP6 (E2)
[ come-brp6-e2_datasheet.pdf, 1.04 MB, Nov.09.2023 ]
参考手册
COMe-bRP6 (E2) User Guide
[ come-brp6_user_guide_1-1_2024_04_19.pdf, 5.53 MB, Apr.19.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
应用案例
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
COME EVAL CARRIER2 T6 38116-0000-00-5 |
COM Express® Evaluation Carier Type 6 | ||
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HSP COME-BRP6 CU-CORE THREADED 38040-0000-99-0 |
Heatspreader for COM-bRP6, Cu-core, threaded mounting holes | ||
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HSP COME-BRP6 CU-CORE THROUGH 38040-0000-99-1 |
Heatspreader for COM-bRP6, Cu-core, through mounting holes | ||
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HSK COME-BASIC ACTIVE (W/O HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
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HSK COME-BASIC PASSIVE (W/O HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
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DDR5-4800 SODIMM 32GB_BRP6 97040-3248-BRP6 |
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
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DDR5-4800 SODIMM 16GB_BRP6 97040-1648-BRP6 |
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
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DDR5-4800 SODIMM 8GB_BRP6 97040-0848-BRP6 |
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
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DDR5-4800 SODIMM 32GB E2_BRP6 97041-3248-BRP6 |
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
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DDR5-4800 SODIMM 16GB E2_BRP6 97041-1648-BRP6 |
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
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DDR5-4800 SODIMM 8GB E2_BRP6 97041-0848-BRP6 |
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM |
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