COMe-bRP6 (E2)

COM Express® Basic Type 6 mit der 13.Generation Intel® Core™ Prozessoren
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Spezifikationen
Bald verfügbar
  • Bis zu 64 GByte DDR5 memory
  • Bis zu 2.5 Gb Ethernet mit TSN support
  • Optional NVMe SSD onboard
  • Industrietaugliche Versionen
Datenblatt herunterladen

Die neuen COM-Express®-Module, basierend auf Intel® Core™ Prozessoren der 13. Generation (früherer Codename Raptor Lake-P) bieten eine deutliche Leistungssteigerung im Vergleich zur vorherigen Generation und sind mit bis zu 14 Prozessorkernen auf Basis der Intel® Performance-Hybridarchitektur ausgestattet.


Die COM-Express®-Module bieten wesentliche, industrietaugliche Funktionen wie Unterstützung für In-Band Error Correction Code (IBECC) Speicher, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) und Extended Temp. Bereich von -40 °C bis +85 °C (in Betrieb).


Alle Funktionen sind perfekt für Anwendungen in anspruchsvollen Bereichen wie Industrieautomation, Gesundheitswesen und Automotive.
 

Eigenschaften

Compliance COM Express® Basic Pin-out Type 6
Dimension (H x W) 125 x 95 mm
CPU Intel® 13th Generation Core™ family
For details see table (CPU variants) given below
Chipset Integrated SoC
Main Memory 2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC)
Graphics Controller Intel® Iris® Xe Graphics on i7/i5 processors
Intel® UHD Graphics on i3/Celeron® processors
Ethernet Controller Intel® I226LM/I226IT
Ethernet Up to 2.5Gb Ethernet with TSN support (depending on SKU)
Storage 2x SATA 6Gb/s
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI Express 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA or alternatively 8x with additional PCIe Switch)
2x4 PCIe 4.0 on PEG Lanes #0-7 1x8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU)
Display DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -,
LVDS: Dual Channel 18/24bit
USB 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0
Serial 2x serial interface (RX/TX only)
Audio High Definition Audio interface
Common Features (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
Special Features POSCAP capacitors, Trusted Platform Module TPM 2.0
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
BIOS AMI Aptio V
Operating System Windows®10, Linux, VxWorks (project based)
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

COMe-bRP6 (E2)
[ come-brp6-e2_datasheet.pdf, 1.04 MB, Nov.09.2023 ]

Manuals

COMe-bRP6 (E2) User Guide
[ come-brp6_user_guide_1-0_2024-01-08.pdf, 5.52 MB, Jan.29.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

Use Cases

Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 4.8 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 2.96 MB, Nov.02.2023 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Weitere Downloads

Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section

Varianten

COMe-bRP6 i7-13800HE
38040-0000-25-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HE, 6x2.5GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i5-13600HE
38040-0000-27-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HE, 4x2.7GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i3-13300HE
38040-0000-21-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HE, 4x2.1GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i7-1370PE
38040-0000-19-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PE, 6x1.9GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i5-1350PE
38040-0000-18-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PE, 4x1.8GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i3-1320PE
38040-0000-17-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PE, 4x1.7GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 E2 i7-13800HRE
38041-0000-25-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HRE, 6x2.5GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i5-13600HRE
38041-0000-27-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HRE, 4x2.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i3-13300HRE
38041-0000-21-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HRE, 4x2.1GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i7-1370PRE
38041-0000-19-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PRE, 6x1.9GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i5-1350PRE
38041-0000-18-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PRE, 4x1.8GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i3-1320PRE
38041-0000-17-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PRE, 4x1.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  

Zubehör

COME EVAL CARRIER2 T6
38116-0000-00-5
COM Express® Evaluation Carier Type 6  
HSP COME-BRP6 CU-CORE THREADED
38040-0000-99-0
Heatspreader for COM-bRP6, Cu-core, threaded mounting holes  
HSP COME-BRP6 CU-CORE THROUGH
38040-0000-99-1
Heatspreader for COM-bRP6, Cu-core, through mounting holes  
HSK COME-BASIC ACTIVE (W/O HSP)
38025-0000-99-0C05
Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP  
HSK COME-BASIC PASSIVE (W/O HSP)
38025-0000-99-0C06
Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP  
DDR5-4800 SODIMM 32GB_BRP6
97040-3248-BRP6
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 16GB_BRP6
97040-1648-BRP6
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 8GB_BRP6
97040-0848-BRP6
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 32GB E2_BRP6
97041-3248-BRP6
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 16GB E2_BRP6
97041-1648-BRP6
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 8GB E2_BRP6
97041-0848-BRP6
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM  


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