COMe-bRP6 (E2)

COM Express® Basic Type 6 with 13th Generation Intel® Core™ Processors
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Specifications
Coming soon
  • Up to 64 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
Download Datasheet

The new COM–Express® modules, based on 13th Gen Intel® Core™  (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture. 


The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C  (operating).


All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive. 

Features

Compliance COM Express® Basic Pin-out Type 6
Dimension (H x W) 125 x 95 mm
CPU Intel® 13th Generation Core™ family
For details see table (CPU variants) given below
Chipset Integrated SoC
Main Memory 2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC)
Graphics Controller Intel® Iris® Xe Graphics on i7/i5 processors
Intel® UHD Graphics on i3/Celeron® processors
Ethernet Controller Intel® I226LM/I226IT
Ethernet Up to 2.5Gb Ethernet with TSN support (depending on SKU)
Storage 2x SATA 6Gb/s
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI Express 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA or alternatively 8x with additional PCIe Switch)
2x4 PCIe 4.0 on PEG Lanes #0-7 1x8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU)
Display DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -,
LVDS: Dual Channel 18/24bit
USB 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0
Serial 2x serial interface (RX/TX only)
Audio High Definition Audio interface
Common Features (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
Special Features POSCAP capacitors, Trusted Platform Module TPM 2.0
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
BIOS AMI Aptio V
Operating System Windows®10, Linux, VxWorks (project based)
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

技术参数

COMe-bRP6 (E2)
[ come-brp6-e2_datasheet.pdf, 1.04 MB, Nov.09.2023 ]

参考手册

COMe-bRP6 (E2) User Guide
[ come-brp6_user_guide_1-1_2024_04_19.pdf, 5.53 MB, Apr.19.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

白皮书

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

应用案例

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMe-bRP6 i7-13800HE
38040-0000-25-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HE, 6x2.5GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i5-13600HE
38040-0000-27-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HE, 4x2.7GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i3-13300HE
38040-0000-21-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HE, 4x2.1GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i7-1370PE
38040-0000-19-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PE, 6x1.9GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i5-1350PE
38040-0000-18-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PE, 4x1.8GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 i3-1320PE
38040-0000-17-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PE, 4x1.7GHz, 2x DDR5 non-ECC SO-DIMM  
COMe-bRP6 E2 i7-13800HRE
38041-0000-25-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HRE, 6x2.5GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i5-13600HRE
38041-0000-27-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HRE, 4x2.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i3-13300HRE
38041-0000-21-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HRE, 4x2.1GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i7-1370PRE
38041-0000-19-7
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PRE, 6x1.9GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i5-1350PRE
38041-0000-18-5
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PRE, 4x1.8GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  
COMe-bRP6 E2 i3-1320PRE
38041-0000-17-3
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PRE, 4x1.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade  

Accessories

COME EVAL CARRIER2 T6
38116-0000-00-5
COM Express® Evaluation Carier Type 6  
HSP COME-BRP6 CU-CORE THREADED
38040-0000-99-0
Heatspreader for COM-bRP6, Cu-core, threaded mounting holes  
HSP COME-BRP6 CU-CORE THROUGH
38040-0000-99-1
Heatspreader for COM-bRP6, Cu-core, through mounting holes  
HSK COME-BASIC ACTIVE (W/O HSP)
38025-0000-99-0C05
Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP  
HSK COME-BASIC PASSIVE (W/O HSP)
38025-0000-99-0C06
Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP  
DDR5-4800 SODIMM 32GB_BRP6
97040-3248-BRP6
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 16GB_BRP6
97040-1648-BRP6
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 8GB_BRP6
97040-0848-BRP6
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 32GB E2_BRP6
97041-3248-BRP6
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 16GB E2_BRP6
97041-1648-BRP6
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM  
DDR5-4800 SODIMM 8GB E2_BRP6
97041-0848-BRP6
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM  


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