COMe-bTL6 (E2)

COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors
Specifications
Coming soon
  • New microarchitecture with up to 8 cores
  • Intel® XeGraphics with 4 Independent Displays (up to 8K)
  • Up to 96 GByte DDR4
  • 3200 MHz memory support
  • Up to 2.5Gb Ethernet with TSN supported
  • Up to 1 TByte NVMe SSD onboard
Download Datasheet

The COM Express® COMe bTL6-H (Tiger Lake-H) CPUs are featuring up to 8 cores and are specifically suited for demanding Edge workloads and high-end, high-bandwidth applications. Intel® Iris® XeGraphics supports up to four independent 4K displays or one 8K HDR display. AI-workloads in machine vision or medical applications reach new levels of performance with the GPU and Intel® Deep Learning Boost. Integrated TSN- and Intel® TCC-functionality enable deterministic networks in Industry 4.0 as well as various real-time applications.

The TDP of the processor chips ranges from 25 to 45 watts, with eight processing cores enabling clock frequencies of up to 5.0 GHz. A maximum of three DDR4 SO-DIMM sockets allow a memory expansion of up to 96 GBytes (non-ECC/ECC). With integrated Intel® UHD graphics supporting up to four independent 4K displays, up to 40 HD video streams can be processed and analyzed in parallel at 1080p/30fps resolution. In addition, fast 2.5 GBit Ethernet with Time Sensitive Networking (TSN) and Intel® Time Coordinated Computing (Intel® TCC) predestines the module for demanding real-time applications. 

As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally used, which enables highly effective data processing even under harsh conditions. The COMe-bTL6 (E2) module guarantees full computing power even in extreme industrial environments with temperatures ranging from -40 °C to +85 °C and offers a higher number of application-ready integrated features and more powerful cooling compared to alternative smaller form factor designs.

Features

Compliance COM Express® basic, Pin-out Type 6
Dimensions (H x W x D) 125 x 95 mm
CPU Intel® 11th Generation CoreTM / Xeon® family For details see table (CPU variants) given below
Chipset HM570E, QM580E and RM590E
Main Memory 2x DDR4 SODIMM dual channel up to 64 GByte ECC or non ECC (optional 3rd SODIMM socket for 96 GByte)
Graphics Controller Intel® Iris®Xe Graphics on i7/i5 processors Intel® xxx Graphics on i3/Xeon® processors
Ethernet Controller Intel® I225LM/I225IT
Ethernet Up to 2.5Gb Ethernet with TSN & WOL support (depending on SKU)
Storage 4x SATA 6Gb/s
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI Express 8x PCIe 3.0 (8GT/s), Default configuration 8x1, optional 1x4 + 4x1, 2x4 etc. 1x16 PCIe 4.0 on PEG Lanes #0-3
Display DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit
USB 4x USB 3.2; 8x USB 2.0
Serial 2x serial interface (RX/TX only)
Audio High Definition Audio interface
Special Features Trusted Platform Module TPM 2.0

(G)SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC, support of Intel® OptaneTM memory technology via PCIe

ON REQUEST:
vPRO (AMT/TXT/AES Support), eDP instead of LVDS, up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI Flash
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
BIOS AMI UEFI
Operating System Windows® 10, Linux, VxWorks
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

技术参数

COMe-bTL6 (E2) Datasheet
[ come-btl6_datasheet.pdf, 859.03 KB, Oct.04.2021 ]

参考手册

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

应用案例

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

Tech Spec Sheet

Tech Specs COM EXPRESS® basic
[ tech-spec_comexpress-basic_web.pdf, 2.9 MB, Feb.26.2021 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

COMe-bTL6 E2 W-11865MRE RM590E
38039-0000-47-8
COMe-bTL6 E2 W-11865MRE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11865MRE, 8x4.7GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 E2 W-11555MRE RM590E
38039-0000-46-6
COMe-bTL6 E2 W-11555MRE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11555MRE, 6x4.6GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 E2 W-11155MRE RM590E
38039-0000-44-4
COMe-bTL6 E2 W-11155MRE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11155MRE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 W-11865MLE RM590E
38038-0000-45-8
COMe-bTL6 W-11865MLE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11865MRE, 8x4.7GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 i7-i7-11850HE QM580E
38038-0000-47-7
COMe-bTL6 i7-i7-11850HE QM580E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-11850HE, 8x4.7GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 W-11555MLE RM590E
38038-0000-44-6
COMe-bTL6 W-11555MLE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11555MLE, 6x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 i5-11500HE QM580E
38038-0000-46-5
COMe-bTL6 i5-11500HE QM580E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-11500HE, 6x4.6GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 i3-11100HE RM590E
38038-0000-44-4
COMe-bTL6 i3-11100HE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-11100HE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 i3-11100HE QM580E
38038-0000-44-3
COMe-bTL6 i3-11100HE QM580E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-11100HE, 4x4.4GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 W-11155MLE RM590E
38038-0000-31-4
COMe-bTL6 W-11155MLE RM590E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11155MLE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bTL6 Celeron 6600HE HM570E
38038-0000-26-2
COMe-bTL6 Celeron 6600HE HM570E COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® 6600HE, 2x2.6GHz, HM570E PCH, GT2, 2x DDR4 non-ECC SO-DIMM  
HSP COMe-bTL6 Cu-core threaded
38038-0000-99-0
HSP COMe-bTL6 Cu-core threaded Heatspreader for COMe-bTL6, Cu-core, threaded mounting holes  
HSP COMe-bTL6 Cu-core through
38038-0000-99-1
HSP COMe-bTL6 Cu-core through Heatspreader for COMe-bTL6, Cu-core, through mounting holes  

Accessories

COMe Eval Carrier2 T6
38116-0000-00-5
COMe Eval Carrier2 T6 COM Express® Eval Carrier2 Type 6 with 5mm COMe connector more
COMe Ref.Carrier–i T6 TMI
38115-0000-00-0
COMe Ref.Carrier–i T6 TMI COM Express® Reference Carrier Type 6 for industrial temperature more
HSP COMe-bSL6/bKL6/bCL6/bTL6 Cu-core threaded
38030-0000-99-0
HSP COMe-bSL6/bKL6/bCL6/bTL6 Cu-core threaded Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6/bTL6 Cu-core threaded mounting holes  
HSP COMe-bSL6/bKL6/bCL6/bTL6 Cu-core through
38030-0000-99-1
HSP COMe-bSL6/bKL6/bCL6/bTL6 Cu-core through Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6/COMe-bTL6 Cu-core through holes  
COMe Active Uni Cooler (w/o HSP)
36099-0000-99-0
COMe Active Uni Cooler (w/o HSP) COM Express® Universal Active Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <20W)  
HSK COMe-BASIC PASSIVE (W/O HSPCOME PASSIVE UNI COOLER (W/O HSP)
36099-0000-99-1
HSK COMe-BASIC PASSIVE (W/O HSPCOME PASSIVE UNI COOLER (W/O HSP) COM Express® Universal Passive Cooler for Heatspreader Mounting (87x78x14.3 mm) (for CPU’s <10 W)  
DDR4-3200 SODIMM 32GB
97020-3232
DDR4-3200 SODIMM 32GB Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 16GB
97020-1632
DDR4-3200 SODIMM 16GB Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 8GB
97020-0832
DDR4-3200 SODIMM 8GB Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 4G
97020-0432
DDR4-3200 SODIMM 4G Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 32GB
97021-3232
DDR4-3200 SODIMM 32GB Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 16GB
97021-1632
DDR4-3200 SODIMM 16GB Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 8GB
97021-0832
DDR4-3200 SODIMM 8GB Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 4GB
97021-0432
DDR4-3200 SODIMM 4GB Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 32GB ECC
97030-3232
DDR4-3200 SODIMM 32GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 16GB ECC
97030-1621
DDR4-3200 SODIMM 16GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 8GB ECC
97030-0832
DDR4-3200 SODIMM 8GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 4G ECC
97030-0432
DDR4-3200 SODIMM 4G ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM  
DDR4-3200 SODIMM 32GB ECC
97031-3232
DDR4-3200 SODIMM 32GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 16GB ECC
97031-1632
DDR4-3200 SODIMM 16GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 8GB ECC
97031-0832
DDR4-3200 SODIMM 8GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  
DDR4-3200 SODIMM 4GB ECC
97031-0432
DDR4-3200 SODIMM 4GB ECC Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature  


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