Kontron presents new COM-HPC® server module with Intel® Xeon® D-1700 processor

Kontron presents new COM-HPC® server module with Intel® Xeon® D-1700 processor

Compact server module with balanced functionality for demanding and space-critical applications

Ismaning, Germany – November 22, 2023 – Kontron,  a leading global provider of IoT/Embedded Computer Technology (ECT), announces its second COM-HPC® server module COMh-sdIL with Intel® Xeon D-1700 processors. The module offers scalability from 2 to 10 cores, SKUs for the extended industrial temperature range and 24/7 reliability over 10 years. These features enable very robust implementations for harsh environments and extreme conditions in a small form factor.
With dimensions of 120 mm x 160 mm in "Size D small", the COM-HPC® server module is even smaller than the usual COM-HPC® Size D design (160 mm x 160 mm). As all components are soldered, the module is particularly resistant to shock and vibration. The module is also available in an extended temperature range of -40°C to +85°C, making it ideal for outdoor applications. It has a maximum of 64 GB soldered DDR4 memory at 2933 MT/s. A soldered NVMe SSD onboard with up to 1 TByte storage capacity is available as an optional storage medium.
With 32x PCIe lanes (16x PCIe Gen3 plus 16x PCIe Gen4 lanes) and 2x Quad LAN interfaces that support up to 100 Gbit Ethernet, the COMh-sdIL offers high data throughput rates for demanding I/O and network structures. With its scalable performance, complemented by AI acceleration with Intel® AVX-512, the module is ideally suited for complex AI applications, high-performance network platforms and edge applications in outdoor environments.
"The module offers balanced functionality in terms of the number of cores, its memory capacity and LAN interfaces. Based on this platform, solutions for the extended temperature range can be implemented. In addition, long-term availability, an important aspect in the embedded market environment, is guaranteed," explains Irene Hahner, Product Manager for COM-HPC® modules at Kontron.

Parallel to the COMh-sdIL, a COMh/Server Application Carrier in an optimized small format and a Board Management Controller (BMC) as a plug-on module for the carrier are being developed. With these building blocks in small form factor design, Kontron offers a complete system solution for space-critical applications and harsh environmental conditions.

The COMh-sdIL server module will be available from Q2 2024.


Further Information:
A photograph in high resolution is provided here:  https://profil-marketing.cloud/index.php/s/W9qPHAHfX5tLmWM

For more information please visit: https://www.kontron.com/en/products/comh-sdil/p182567




About Kontron

Kontron is a global leader in IoT/Embedded Computing Technology (ECT) and offers individual solutions in the areas of Internet of Things (IoT) and Industry 4.0 through a combined portfolio of hardware, software and services. With its standard and customized products based on highly reliable state-of-the-art technologies, Kontron provides secure and innovative applications for a wide variety of industries. As a result, customers benefit from accelerated time-to-market, lower total cost of ownership, extended product lifecycles and the best fully integrated applications. For more information, please visit: www.kontron.com





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Media Contact:

Alexandra Kentros
Kontron AG - Communications
Tel: +49 151 151 9388 1



All rights reserved. Kontron is a trademark or registered trademark of Kontron Europe GmbH. All other brand or product names are trademarks or registered trademarks or copyrights by their respective owners and are recognized. All data is for information purposes only and not guaranteed for legal purposes. Subject to change without notice. Information in this press release has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies.


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