COMe-bV26 New

COM Express® Basic V2000 with AMD Embedded V-Series high-performance “Zen2” CPU
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Specifications
  • Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
  • Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
  • Optional up to 1 TByte NVMe SSD onboard
  • Industrial grade versions available
Download Datasheet

Downloads

Use Cases

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ Ectron Case Study Resized.pdf, 3.93 MB, Jul.01.2022 ]

技术参数

Datasheet COMe-bV26
[ come-bv26_datasheet.pdf, 2.01 MB, Jun.02.2022 ]

参考手册

COMe-bV26 User Guide
Rev 1.1 Jul. 28, 2022
[ come-bv26_user-guide_rev-1.1_2022-07-26.pdf, 2.89 MB, Jul.28.2022 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

白皮书

Computer-on-Modules for Medical Diagnostics and Surgery [restrictions apply]
Kontron’s new COM Express® Basic, Type 6 module, with AMD Ryzen™ Embedded V2000 processor is literally made for computing applications in medical diagnostics and operating theatres: Next to impressively powerful processor-integrated graphics, they provide massive computing power to run AI algorithms in parallel thanks to their 8 cores and up to 7 AMD Radeon™ compute units. The outcome is optimized imaging for faster medical diagnostics.

应用案例

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ Artikel_Processor Choice_eu[1].pdf, 4.42 MB, Nov.15.2022 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS® basic
[ tech-spec_comexpress-basic_web.pdf, 8.95 MB, Jun.10.2022 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

COMe-bV26 V2748
38036-0000-29-8
COMe-bV26 V2748 COM Express® basic pin-out type 6 Computer-on-Module with AMD V2748, 8x2.9GHz, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bV26 V2718
38036-0000-17-8
COMe-bV26 V2718 COM Express® basic pin-out type 6 Computer-on-Module with AMD V2718, 8x1.7GHz, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bV26 V2546
38036-0000-30-6
COMe-bV26 V2546 COM Express® basic pin-out type 6 Computer-on-Module with AMD V2546, 6x3.0GHz, 2x DDR4 non-ECC/ECC SO-DIMM  
COMe-bV26 V2516
38036-0000-21-6
COMe-bV26 V2516 COM Express® basic pin-out type 6 Computer-on-Module with AMD V2516, 6x2.1GHz, 2x DDR4 non-ECC/ECC SO-DIMM  

Accessories

HSP COMe-bV26 Cu-core threaded
38036-0000-99-0
HSP COMe-bV26 Cu-core threaded Heatspreader for COMe-bV26, Cu-core, threaded mounting holes  
HSP COMe-bV26 Cu-core through
38036-0000-99-1
HSP COMe-bV26 Cu-core through Heatspreader for COMe-bV26, Cu-core, through mounting holes  
DDR4-3200 SODIMM 4GB_BV26
97020-0432-BV26
DDR4-3200 SODIMM 4GB_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 8GB_BV26
97020-0832-BV26
DDR4-3200 SODIMM 8GB_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 16GB_BV26
97020-1632-BV26
DDR4-3200 SODIMM 16GB_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 32GB_BV26
97020-3232-BV26
DDR4-3200 SODIMM 32GB_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 4GB ECC_BV26
97030-0432-BV26
DDR4-3200 SODIMM 4GB ECC_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 8GB ECC_BV26
97030-0832-BV26
DDR4-3200 SODIMM 8GB ECC_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 16GB ECC_BV26
97030-1632-BV26
DDR4-3200 SODIMM 16GB ECC_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
DDR4-3200 SODIMM 32GB ECC_BV26
97030-3232-BV26
DDR4-3200 SODIMM 32GB ECC_BV26 Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26  
COMe Eval Carrier2 T6
38116-0000-00-5
COMe Eval Carrier2 T6 COM Express® Eval Carrier2 Type 6 with 5mm COMe connector more
HSK COMe-basic active (w/o HSP)
38025-0000-99-0C05
HSK COMe-basic active (w/o HSP) Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP  
HSK COMe-basic passive (w/o HSP)
38025-0000-99-0C06
HSK COMe-basic passive (w/o HSP) Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP  


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