Design

  • Simulation (Thermal, Elektronic, …)
  • Methods: Design for xxx, V-Modell
  • Elektronics Design
    •  Microprocessors (x86, ARM, ...)
    • Switch/Network Processors
    • FPGA
    • Wireless (WiFi, Bluetooth, GSM/5G, ...)
    • Integration of field buses
    • Layout
      • Normal and HDI technology, up to 30 layers
      • Power integrity and high-speed signal simulations
      • Memory-Down
      • 3D data for system integration
  • Thermal design
    • Thermal and airflow simulation
    • Passive and active cooling
    • Heatpipes
    • Controller for outdoor solutions
  • System Design
    • Design
    • Konstruktion incl. early 3D Samples
    • Tooling
    • Materials: steel/stainless steel sheets, aluminum, magnesium, plastics
    • Surfaces: untreated, painted, powdered 
  • Software design
    • µC Firmware
    • CPU UEFI-BIOS
    • Low level drivers
    • Industrial middleware (z.B. predictive maintenance)
    • Board Support Packages for Windows und Linux
    • Application software und cloud connectivity
  • Prototypes
    • Fast realization of functional samples 
    • Rapid prototyping for mechanics
  • Bring up
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