COM-HPC® - NEW COMPUTER ON MODULES STANDARD
Read about reasons why for a new computer on module standard, the technical insights and a comparison with COM Express®
COM-HPC®: HIGH PERFORMANCE COMPUTING
Data growth is unstoppable and the upcoming 5G wireless standard will accelerate it. Experts expect new digital business models that are only conceivable due to the high data transfer rates of the upcoming 5G standard. Applications such as artificial intelligence come with enormous data hunger and require the lightning-fast, algorithm-based evaluation of the huge amount of data. IoT devices, sensors and actuators, of which more are connected to the Internet every hour, continue to produce enormous amounts of data from autonomous vehicles, for example. Hundreds of signals have to be processed in fractions of a second. Many of these scenarios no longer take place in a protected high-performance computing center or in the cloud, but close to where the data originates: on mobile masts, on production lines, in warehouses, at processing plants or in autonomous vehicles, to name just a few.
New concepts for embedded computers are required where existing standards are no longer sufficient to cope with the high volume of data and the computing power required to process this data.
In order to give an answer to the demanding new challenges in embedded computing the PICMG standardization committee is defining a new computer on module standard - COM-HPC® for High Performance Computing.
Find the technical insights and the market informations in these assets:
Kontron COM-HPC®/Server Module and Evaluation Carrier Systems.Kontron COM-HPC®/Server Module and Evaluation Carrier Systems.
COM-HPC® targets
COM-HPC® /CLIENT AND COM-HPC/SERVER
In general COM-HPC® is going to address two different use cases:
COM-HPC® /Client: embedded including graphics support
COM-HPC® /Server: server-type with focus to high ethernet bandwidth
COM-HPC®/Client
COMPUTING PERFORMANCE WITH UP TO 65W PROCESSOR TDP
Computing performance with up to 65W processor TDP
Up to 48 + 1 PCI Express Gen4/5 lanes
Up to 4 graphics interfaces
Up to 2x 25 Gb Ethernet interfaces
Module size:
Size A: 95 x 120 mm
Size B: 120 x 120 mm
Size C: 160 x 120 mm
COM-HPC®/Server
COMPUTING PERFORMANCE WITH UP TO 125W PROCESSOR TDP
Computing performance with up to 125W processor TDP
Up to 64 + 1 PCI Express Gen4/5 lanes
No graphic interfaces
Up to 8x 25 Gb Ethernet interfaces
Module size:
Size D: 160 x 160 mm
Size E: 200 x 160 mm
COM-HPC®/CONNECTOR
In order to support the future oriented pin-out definition a new connector will be introduced with 400 pins.
The COM-HPC® standard defines the use of two connectors adding up to a powerful connectivity bandwidths of 800 pins.
5mm/10mm stack hight.
Quick overview regarding details: COM-HPC® and COM-Express®
COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005, will continue to provide a reliable and long-lasting service for traditional embedded industrial computing demands. Here we give an overview and comparison of the technical details between COM-HPC® and COM Express® for your orientation:
PICMG - SPONSORS AND SUPPORTING COMPANIES
SPONSORS:
Adlink, congatec, Kontron
MEMBERS:
ADLINK, Advantech, congatec, Elma Electronic, ICC Intelligent Platforms, ept, Fastwel, GE Automation, Heitec, Intel, Kontron, Avnet Integrated, NAT, nVent, Samtec, Seco, Supermicro, TE Connectivity, Trenz Electronic, University Bielefeld, VersaLogic Corp
OFFICIAL POSITIONS:
Chairman: Christian Eder, congatec Editor: Stefan Milnor, Kontron
Secretary: Dylan Lang, Samtec
