COM HPC | Kontron Embedded Computers

IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COM-HPC® - NEW COMPUTER ON MODULES STANDARD

Read about reasons why for a new computer on module standard, the technical insights and a comparison with COM Express®

COM-HPC®: HIGH PERFORMANCE COMPUTING

Data growth is unstoppable and the upcoming 5G wireless standard will accelerate it. Experts expect new digital business models that are only conceivable due to the high data transfer rates of the upcoming 5G standard. Applications such as artificial intelligence come with enormous data hunger and require the lightning-fast, algorithm-based evaluation of the huge amount of data. IoT devices, sensors and actuators, of which more are connected to the Internet every hour, continue to produce enormous amounts of data from autonomous vehicles, for example. Hundreds of signals have to be processed in fractions of a second. Many of these scenarios no longer take place in a protected high-performance computing center or in the cloud, but close to where the data originates: on mobile masts, on production lines, in warehouses, at processing plants or in autonomous vehicles, to name just a few.

New concepts for embedded computers are required where existing standards are no longer sufficient to cope with the high volume of data and the computing power required to process this data.

In order to give an answer to the demanding new challenges in embedded computing the PICMG standardization committee has defined a new computer on module standard - COM-HPC® for High Performance Computing.

Find the technical insights and the market informations in these assets:

Kontron COM-HPC®/Server Module and Evaluation Carrier Systems.

COM-HPC® Form Factors

COM-HPC®/Mini

Power envelope typ. up to 40W

Up ot 16x PCI Express GenS/6 lanes
Up ot 2x NBase-T (max 10Gb) |
Up ot 4x USB 4 (2x DDI shared with USB 4) |
Module size:
95 x70 mm

COM-HPC®/Client

Power envelope typ. up to 100W

Up ot 48 +1PC Express Gen5/6 lanes
Up to 4 graphics interfaces
Up to 2x 25 Gb Ethernet interfaces
Module size:
Size A: 95 x 120 mm
Size B: 120 x 120 mm
Size C: 160 x 120 mm

COM-HPC®/Server

Power envelope typ. up to 180W

Up to 64 +1 PCI Express Gen5/6 lanes
No graphic interfaces
Up to 8x 25 Gb Ethernet interfaces
Module size:
Size D: 160 x160 mm
Size :E 200 x 160 mm

COM-HPC®/CONNECTOR

In order to support the future oriented pin-out definition a new connector has been introduced with 400 pins. The COM-HPC® standard defines 5mm and 10mm stack height for the carrier connector. The Mini size uses a single connector; all other sizes use two connectors for a total of 800 pins addressing the increasing performance demands and bandwidth needs.
5mm/10mm stack height.

Quick overview regarding details: COM-HPC® and COM-Express®

COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005, will continue to provide a reliable and long-lasting service for traditional embedded industrial computing demands. Here we give an overview and comparison of the technical details between COM-HPC® and COM Express® for your orientation:

Dive deep into the Kontron COM-HPC product portfolio!

Solution brief

Intel Solution Brief - The Intel® Xeon® D Processor powers High-Performance Kontron COM-HPC ® for Edge Servers

Two COM-HPC® Server modules (Size D) – high core count and low core count - for high performance computing provide extraordinary power and connectivity for edge servers. ...

Whitepaper

The new Standard COM-HPC – Delivering future proofed power and connectivity

In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing ...

Computer-on-Modules Invade HPC

A range of industry applications face escalating demand for high-performance embedded computing. More specifically, this growing demand is for solutions built on standard ...