IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

资源

We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.

Learn more about how Kontron supports its customers by improving their products and solutions. Read our Use Cases. Contact us for further information.

Learn more about our solutions for various industries by downloading our Whitepapers.

We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.

Get extended insights into our products and solutions by participating in our webcasts. You can find all webcasts here. Contact us for further information.

3U cPCI Power Backplanes

The 3U cPCI Power Backplanes from Kontron Hartmann-Wiener are robust, compact power-distribution boards compatible with CompactPCI (PICMG) systems.

Specifications

Support for compact 1–4 slot cPCI systems
Dual connector options: DIN 41612 or P47
PICMG 2.0 and 2.11 compatibility
Parallel chaining of multiple backplanes
Wide operating temperature range (–40 °C … +85 °C)
High relative humidity tolerance (non-condensing)
Rugged build with flame-retardant FR-4 material
Several part variants for various power and board configurations

Download Datasheet

They support 1 to 4 slots and can be outfitted with DIN 41612 or P47 power connectors. These backplanes comply with PICMG 2.0 and PICMG 2.11 standards, enabling parallel chaining of multiple boards.

The 3U cPCI Power Backplanes act as power distribution hubs in CompactPCI systems. They align with established PICMG power standards (PICMG 2.0 / 2.11), allowing seamless integration with standard cPCI systems. The use of DIN 41612 or P47 connectors gives flexibility in power source selection. Their design allows multiple backplanes to be chained in parallel, making them scalable for larger systems. Even in harsh environments, due to wide temperature tolerance (–40 °C to +85 °C) and high humidity tolerance, they maintain reliable operation.

Features

Form Factor: 3U height

Slots: 1, 2, 3, or 4 cPCI slots

Base Spec: PICMG 2.0 / PICMG 2.11

Power Connector Types: DIN 41612 type M or P47 plug-in connectors

Parallel Support: Yes — supports parallel connection of multiple backplanes

Operating Temperature: –40 °C to +85 °C

Relative Humidity: 90%, non-condensing
Material / Flame Rating: FR-4, UL 94 V-0

Key Part Numbers / Variants:
• 3U, 4-slot, P47 connector (ECO)
• 3U, 3-slot, P47 connector (ECO)
• 3U, 2-slot, P47 (L2) with 3-pin MATE-N-LOK connector
• 3U, 1-slot, P47 (L1)
• 3U, 1-slot, DIN41612 type M
• 3U, 1-slot, DIN41612 type M (reversed mounting)