IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

资源

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Learn more about our solutions for various industries by downloading our Whitepapers.

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3.5"-SBC-TGL-6-i5-1145G4E

Intel® Core™ i5-1145G7E, without B2B connector, without vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C

Specifications

Intel® Core™ i5-1145G7E
w/o B2B connector
w/ vPro
Operating temperature: 0 °C ~ 60 °C

Download Datasheet

Dramatic Leap in Graphics Performance

Intel® Core™ i5-1145G7E, w/o B2B connector, w/ vPro, Operating temperature: 0 °C ~ 60 °C

Downloads

Use Cases

技术参数

3.5"-SBC-TGL Datasheet
Revision 20240820, August 20, 2024
[ 3d5-sbc-tgl-datasheet-20240820.pdf, 1.12 MB, Aug.20.2024 ]

参考手册

3.5"-SBC-TGL User Guide
Revision 2.6, February 25, 2026
[ kontron-3d5-sbc-tgl-user-guide-rev-2d6-2026-02-25.pdf, 1.93 MB, Mar.09.2026 ]

3.5"-SBC Copper Pillar, Thermal Solution & eIO Installation Guide
Revision 1.0, April 14, 2025
[ 3d5-sbc-copper-pillar-thermal-solution-eio-installation-guide-rev-1d0-2025-04-14.pdf, 594.85 KB, Apr.18.2025 ]

3.5"-SBC M.2 Module Installation Guide
Revision 1.0, March 31, 2025
[ 3d5-sbc-md2-installation-guide-rev-1d0-2025-03-31.pdf, 119.86 KB, Apr.18.2025 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Dec.16.2025 ]

快速查询手册

3.5"-SBC-TGL Quick Installation Guide
Revision 1, May 19, 2022
[ kontron-3d5-sbc-tgl-qig-20220519.pdf, 869.46 KB, May.19.2022 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

3.5”-SBC-TGL-0-i5-1145G7E		Intel® Core™ i5-1145G7E, B2B connector, vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C.
3.5”-SBC-TGL-1-i3-1115G4E		Intel® Core™ i3-1115G4E, B2B connector, vPro Bios, TDP 12W, Operating temperature: 0 °C ~ 60 °C
3.5”-SBC-TGL-2-i7-1185G7E		Intel® Core™ i7-1185G7E, B2B connector, vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C
3.5”-SBC-TGL-3-6305E 43017-0000-18-2		Intel® Celeron® 6305E, B2B connector, without vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C
3.5”-SBC-TGL-4-i7-1185GRE-XT		Intel® Core™ i7-1185GRE, B2B connector, vPro Bios, TDP 15W, Operating temperature: -20 °C ~ 70 °C
3.5”-SBC-TGL-5-i5-1145GRE-XT		Intel® Core™ i5-1145GRE, B2B connector, vPro Bios, TDP 15W, Operating temperature: -20 °C ~ 70 °C
3.5"-SBC-TGL-6-i5-1145G4E	$3.5\$	Intel® Core™ i5-1145G7E, without B2B connector, without vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C
3.5"-SBC-TGL-7-i3-1115G4E	$3.5\$	Intel® Core™ i3-1115G4E, without B2B connector, without vPro Bios, TDP 12W, Operating temperature: 0 °C ~ 60 °C
3.5"-SBC-TGL-8-i7-1185G7E	$3.5\$	Intel® Core™ i7-1185G7E, without B2B connector, without vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C
3.5"-SBC-TGL-9-6305E	$3.5\$	Intel® Celeron® 6305E, without B2B connector, withou vPro Bios, TDP 15W, Operating temperature: 0 °C ~ 60 °C

Accessories

3.5" Extended I/O Board (3.5"-eIO-GPA-0) 1069-6159	$3.5\$	2x DP, 2x 2.5 GbE LAN, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, 1x DC In Terminal Block, Intel® I226-LM Ethernet Controller, Operating temperature: 0 °C ~ 60 °C	more
3.5" Extended I/O Board (3.5"-eIO-GPA-1) 1069-6922	$3.5\$	2x DP, 2x 2.5 GbE LAN, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, Intel® I226-LM Ethernet Controller, Operating temperature: 0 °C ~ 60 °C	more
3.5" Extended I/O Board (3.5"-eIO-GPA-2-XT) 1073-9682	$3.5\$	2x DP, 2x 2.5 GbE LAN, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, 1x DC In Terminal Block, Intel® I226-IT Ethernet Controller, Operating temperature: -40 °C ~ 85 °C	more
Heatsink - Cooling Solution 1067-5535		Heatsink with Fan, 15W tdp
DC Jack Cable 1064-2433		2.5 DC Jack with 2 mm Nut and 0.5 mm Washer to1x4P 3.0 pitch, L=300 mm Part No.: 0C5020000004220L
COM_Port Cable 1064-2427		D-SUB 9P (male) to 1x10P 1.25 pitch, L=350 mm
DIO Cable 1065-3137		D-SUB-9P(Female) to 1x10P 1.25 pitch, L=200mm
2-Port USB 2.0 Cable 1069-7893		2x5-pin pitch 2.0 mm to 2x USB Type A 4P Female w/ bracket, L = 270 mm
SATA Power Cable 1064-2430		SATA Power Cable, SATA 1x15P Pitch:1.27mm to PH 2.0 HSG 1x4P 2.0pitch, L=460mm
SATA Cable with Lock 1064-2431		SATA Cable with Lock, 1X7P (1.27 pitch), L=460 mm
Audio Cable w/ 3x Phone Jack 1070-1245		HRS DF13-10DS-1.25C 1.25 pitch to PJ-2509CTPC-5-L (3.5 mm phone jack) x3, L = 400 mm
AC to DC Power Adapter (12 V) 1069-3055		Input: AC 90 V ~ 264 V, output: DC 12 V @ 5 A Max. 60 W
Starter Kits for 3.5"-SBC-TGL 1069-6976	$Starter Kits for 3.5\$	1x DC In Cable, 1x SATA Cable, 1x SATA Power Cable, 1x COM Port Cable, 1x DIO Cable, 1x 2-port USB Cable, 1x Audio Cable, 1x Power Adapter, 1x Cooler