Boost AI Compuitng Performance at the Edge
3.5"-SBC-PTL is engineered around hybrid-architecture Intel® Core™ Ultra 300 Series processors with upgraded iGPU and next-gen integrated NPU and is able to deliver breakthrough efficiency, advanced AI acceleration and exceptional graphics capability to satisfy modern multitasking, demanding visual workloads and AI-driven applications.
Built on Intel's refined tri-tier core configuration, combing high-speed Performance Cores (P-Cores), power-saving Efficient Cores (E-Cores) and specialized Low-Power Efficient Cores (LP-E Cores) on a single chip, 3.5”-SBC-PTL can intelligently manage high-intensity / demanding, high-throughput parallel / background and always-on standby / status tracking tasks and then dynamically assign them to the corresponding cores mentioned above. In this way, both efficiency and performance can reach the maximum level at the same time and then minimize thermal output, significantly increasing hardware longevity and system reliability in harsh environments.
With the brand-new Intel® Xe3-based integrated GPU inside the processor, 3.5"-SBC-PTL delivers near-discrete-class graphics performance, enabling faster vision, inference, visualization and high-throughput graphics processing. In addition, the latest integrated NPU 5 delivers faster and more power-efficient on-device AI inference, making the board ideal for sustained always-on AI tasks as well, such as 24/7 condition monitoring and predictive maintenance.
3.5"-SBC-PTL features a discrete TPM 2.0 security chip with its own dedicated internal resources and can provide superior security mechanism against cyber threats. The SBC also supports Time-Sensitive Networking (TSN) technology and assures real communications over Ethernet. Combining two features ensures secure and reliable real-time performance for applications requiring synchronized operations along with robust security.
3.5"-SBC-PTL can operate over a wide input voltage range from DC 9 V to 36 V To accommodate to diverse electrical conditions, such as unstable power supply, random power surge and versatility of applications. In addition to commercial-grade operating temperature range, the board also offers industrial-grade variants capable of withstanding extreme temperatures from -40 °C to 85 °C. This robust thermal tolerance ensures reliable operation in harsh outdoor settings, industrial facilities and other mission-critical environments.
Finally, 3.5"-SBC-PTL supports a board-to-board connector and a board-to-wire connector with up to PCIe x8 bandwidth, providing additional I/O ports and extra graphics / AI acceleration card(s) respectively without the restriction of small form factor. Three M.2 expansion slots are available as well for (NVMe) SSD, Wi-Fi, Bluetooth, 4G / 5G and other possible expansions.
| Processor | Intel® Core™ Ultra 9 386H (4P+8E+4LPE, 18M, ~4.9GHz, 25→65W) Intel® Core™ Ultra 7 366H (4P+8E+4LPE, 18M, ~4.8GHz, 25→65W) 365 (4P+0E+4LPE, 12M, ~4.8GHz, 25→55W) 356H (4P+8E+4LPE, 18M, ~4.7GHz, 25→65W) 355 (4P+0E+4LPE, 12M, ~4.7GHz, 25→55W) Intel® Core™ Ultra 5 338H (4P+4E+4LPE, 18M, ~4.7GHz, 25→65W) 336H (4P+4E+4LPE, 18M, ~4.6GHz, 25→65W) 335 (4P+0E+4LPE, 12M, ~4.6GHz, 25→55W) 325 (4P+0E+4LPE, 12M, ~4.5GHz, 25→55W) 332 (2P+0E+4LPE, 12M, ~4.4GHz, 25→55W) 322 (2P+0E+4LPE, 12M, ~4.4GHz, 25→55W) |
| Main Memory | 2x DDR5 6400/7200 SO-DIMM up to 128 GByte |
| Graphics Controller | Intel® Arc™ B370 (Core™ Ultra 5 338H) Intel® Graphics (others) |
| Display | 1x eDP / LVDS (24-bit, 2-ch) 3x DP (2x Full-size DP on rear, 1x DP USB-C on rear) Quadruple Display support |
| Audio CODEC | TSI 92HD91B |
| Audio Interface | 1x Speaker-out (Stereo, by header) 1x Line-in (by header) 1x Line-out (by header) 1x Mic-in (by header) 1x S/PDIF Out (by header) |
| Ethernet Controller | Intel® I226-LM/IT |
| Ethernet | 2x 2.5 GbE LAN (RJ45 on rear) |
| USB | 3x USB 3.2 Gen 2 (2x Type A on rear, 1x Type C on rear w/ DP & PD 5 V / 3 A) 2x USB 2.0 (1x Type A on rear, 1x by header & +1 in case of no CAN Bus) |
| Serial Ports | 2x RS232/422/485 (by header) |
| DIO | 8x DIO (by header) |
| CAN BUS | 2x CAN Bus (by header, -2 in case of 2x USB 2.0 by header or on B2B) |
| Expansion | 1x M.2 Key B (Type 3042/3052/2280, w/ PCIe x2 / USB 2.0 / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0) 1x M.2 Key M (Type 2280, w/ PCIe x4) 1x SIM Card Holder (by header) 1x Board-to-board Connector (1x DDI, 2x MIPI CSI-2 (2x2 / 1x4), 1x PCIe x2 / 2x PCIe x1, 1x PCIe x1, 2x I3C, 1x UART, 1x GSPI, 2x USB 2.0 (optional)) 1x Board-to-wire Connector (1x PCIe x8 / 2x PCIe x4 (Core™ Ultra 9 386H / 7 366H / 7 356H only)) |
| Input Voltage | DC 9 V ~ 36 V |
| Power connector | 1x4-pin pitch 3.0 mm Wafer |
| BIOS | AMI uEFI BIOS |
| Watchdog | Programmable WDT to generate system reset event |
| System Monitoring | Voltages Temperatures |
| Real Time Clock | Processor integrated RTC |
| TPM | dTPM 2.0 (Infineon SLB 9672) |
| Cooling | 1x Wafer for Smart Fan |
| Operating System | Windows 11, Linux |
| Form Factor | ECX (146 mm x 105 mm / 5.75" x 4.13") |
| Operating Temperature | 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
| Storage Temperature | -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) |
| Humidity | 0 % ~ 95 % |
| EMC | CE Class B, FCC Class B, ICES Class B, UKCA Class B |
| Safety | UR (UL Recognized), CSA |
3.5"-SBC-PTL Datasheet
Revision 20251212, December 12, 2025
[ 3d5-sbc-ptl-datasheet-20251212.pdf, 2.91 MB, Dec.12.2025 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Dec.16.2025 ]
3.5" SBC Tech Spec Sheet
Revision 20250320, March 20, 2025
[ 3d5-sbc-tech-spec-sheet-20250320.pdf, 2.68 MB, Nov.05.2025 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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