3.5"-SBC-P100

3.5" Single Board Computer with AMD Ryzen™ AI Embedded P100 Series Processors
Specifications
Coming soon
  • AMD Ryzen™ AI Embedded P100 series processor
  • AI acceleration XDNA™ 2 Architecture NPU
  • 2x 2.5 GbE Ethernet Controller and 2x CAN FD buses integrated
  • Various expansion capabilities by board to board connector, M.2 sockets
  • Industrial-grade operating temperature range, wide voltage input
Download Datasheet

Energy-Efficient & Powerful Platform for Next Gen AI Solutions

3.5"-SBC-P100 is powered by AMD Ryzen™ AI Embedded P100 Series processors with iGPU Radeon™ RDNA™ 3.5 and integrated NPU XDNA™ 2, delivering cutting-edge graphics performance and next-level AI inference acceleration. It features 2.5 GbE with TSN and dTPM 2.0 support, ensuring real-time and secure communications. Finally, the board supports a board-to-board connector and a board-to-wire connector, providing additional I/O ports and extra graphics / AI acceleration card(s) respectively without the restriction of small form factor.

Features

Processor AMD Ryzen™ AI Embedded P164 (8C, 16M, ~ 5 GHz, 15 W ← 28 W → 54 W TDP)
AMD Ryzen™ AI Embedded P164i (8C, 16M ~ 5 GHz, 15 W ← 28 W → 54 W TDP)
AMD Ryzen™ AI Embedded P132 (6C, 8M, ~ 4.5 GHz, 15 W ← 28 W → 54 W TDP)
AMD Ryzen™ AI Embedded P132i (6C, 8M, ~ 4.5 GHz, 15 W ← 28 W → 54 W TDP)
AMD Ryzen™ AI Embedded P121 (4C, 8M, ~ 4.4 GHz, 15 W ← 28 W → 54 W TDP)
AMD Ryzen™ AI Embedded P121i (4C, 8M, ~ 4.4 GHz, 15 W ← 28 W → 54 W TDP)
Graphics AMD Radeon™ RDNA™ 3.5 (2.8 / 2.8 / 2.8 / 2.8 / 2.7 / 2.7 GHz resp.)
AI Accelerator AMD XDNA™ 2 (50 / 50 / 50 / 50 / 30 / 30 TOPS resp.)
Main Memory 2x DDR5 5600 SO-DIMM up to 128 GByte (Sideband ECC support)
Display 1x eDP (4096 x 2304 @ 120 Hz) / LVDS (24-bit, 2-ch, 1920 x 1200 @ 60 Hz) (switchable by BIOS)
3x DP (7680 x 4320 @ 60 Hz, 2x Full-size DP on rear, 1x DP USB-C on rear)
Quadruple Display
Audio CODEC TSI 92HD91B
Audio Interface 1x Speaker-out (Stereo, by header)
1x Line-in (by header)
1x Line-out (by header)
1x Mic-in (by header)
Ethernet Controller Intel® I226-V/IT
Ethernet 2x 2.5 GbE LAN (RJ45 on rear)
TSN support for models with P121(i) & P132(i) CPUs
USB 3x USB 3.2 Gen 2 (2x Type A on rear, 1x Type C on rear w/ DP & PD 5 V / 3 A)
3x USB 2.0 (1x Type A on rear, 2x by header & -1 in case of CAN Buses)
Serial Ports 2x RS232/422/485 (by header)
GPIO 8x GPIO (by header)
CAN BUS 2x CAN FD Bus (optional, by header, optional, trade o 1x USB 2.0 header)
Expansion 1x M.2 Key B (Type 3042/3052/2280, w/ PCIe x1 / USB 2.0 / 2x UIM)
1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0)
1x M.2 Key M (Type 2280, w/ PCIe x4)
2x SIM Card Holder (by header)
1x Board-to-board Connector (1x DDI, 2x PCIe x1, 2x USB 2.0, 2x I3C, 1x UART, 1x GSPI)
1x Board-to-wire Connector (1x PCIe x4, 1x PCIe x2 (p164(i) only))
Input Voltage DC 9 V ~ 36 V
Power connector 1x4-pin pitch 3.0 mm Wafer
BIOS AMI uEFI BIOS
Watchdog Programmable WDT to generate system reset event
System Monitoring Voltages, Temperatures
Real Time Clock Processor integrated RTC
TPM dTPM 2.0 (Infineon SLB 9672)
Cooling 1x Wafer for Smart Fan
Operating System Windows 11, Linux
Form Factor ECX (146 mm x 105 mm / 5.75" x 4.13")
Operating Temperature 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard)
-40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme)
Storage Temperature -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard)
-55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme)
Humidity 0 % ~ 95 %
EMC CE Class B, FCC Class B, ICES Class B, UKCA Class B
Safety UR (UL Recognized), CSA

Downloads

技术参数

3.5"-SBC-P100 Datasheet
Revision 20260305, March 5, 2026
[ 3d5-sbc-p100-datasheet-20260305.pdf, 2.03 MB, Mar.20.2026 ]

参考手册

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Dec.16.2025 ]

Tech Spec Sheet

3.5" SBC Tech Spec Sheet
Revision 20250320, March 20, 2025
[ 3d5-sbc-tech-spec-sheet-20250320.pdf, 2.53 MB, Apr.01.2026 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]



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