This product is not recommended for new designs.
Not recommended for new designs
VX3830
3U VPX Xilinx® Virtex®-5 FPGA Processor Board with FMC Site
- Increased I/O Flexibility and Scalable Development Solutions
- x4 or x1 PCI-Express Backplane Interface
- Standard Air- and Rugged Conduction-Cooled Versions
- 0.8" (4 HP) or 1" (5 HP) Face Plates
3U VPX Carrier Board for VITA 57 FPGA Mezzanine Cards (FMC)
To implement custom interfaces using VX3830, the customer develops his IP using Xilinx® tools, and designs a specific FMC. The FPGA image is loaded from a Flash on VX3830 or on the FMC. A rescue FLASH is also present to ease developments and secure deployments.
VX3830 features a Xilinx® Virtex®-5 FPGA (XC5VLX20T) featuring a PCIe endpoint and User I/Os. VX3830 connects its FPGA endpoint to the backplane through a x4 PCIe gen 2 channel (P1 Wafers 1 to 4 is default build option). Selection between x4 or x1 PCIe width is user configurable.
VX3830 is available as a Convection Cooled or Conduction Cooled 3U VPX payload board. It requires +5V and +12V power supply rails. VX3830 is a member of Kontron's VPX Ecosystem and is qualified with VX3230 and VX3030 SBCs. Kontron also offers a VITA 57 FMC slot on VME products.
Kontron also offers a development kit containing: FMC-SER0 a sample FMC with wrapping areas, a simple FPGA IP and a Linux rpm with drivers, utilities and test programs. This kit allows non regression tests and is the base for customized derivative work.
VX3830 features a Xilinx® Virtex®-5 FPGA (XC5VLX20T) featuring a PCIe endpoint and User I/Os. VX3830 connects its FPGA endpoint to the backplane through a x4 PCIe gen 2 channel (P1 Wafers 1 to 4 is default build option). Selection between x4 or x1 PCIe width is user configurable.
VX3830 is available as a Convection Cooled or Conduction Cooled 3U VPX payload board. It requires +5V and +12V power supply rails. VX3830 is a member of Kontron's VPX Ecosystem and is qualified with VX3230 and VX3030 SBCs. Kontron also offers a VITA 57 FMC slot on VME products.
Kontron also offers a development kit containing: FMC-SER0 a sample FMC with wrapping areas, a simple FPGA IP and a Linux rpm with drivers, utilities and test programs. This kit allows non regression tests and is the base for customized derivative work.
Technical data
| Dimensions (H x W x D) | 99.85 mm x 162.54 mm; 0.8 inch face plate. (1 inch is a built option) |
|---|---|
| Interface | VPX: PCI-Express interface to VPX Data Plane 1 (P1 wafers 1 to 4). Interface to Data Plane 2 (P1 wafers 5 to 8) is a build option |
| Temperature | Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C |
| Cooling | Convection or Conduction |
| Operation Temperature | Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C |
Accessories
Select accessories here
FMC-SER0
VITA 57 compliant FPGA Mezzanine Card (FMC)
Customer Portal
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