COBALT™
Reduced SWAP - Rugged Embedded Computer
This product is not recommended for new designs.
Specifications
- Small Form Factor 8.5" (216mm) x 5.5" (140mm) x 3.9" (99mm)
- Intel® Core™ i7 processor options via COM Express® Type 6
- Rugged, IP67 Sealed System
- Configurable Front Panel for Modular I/O Profi le Options
- Supports XMC and mPCIe modules
- Extended Temperature -40ºC to +71ºC
- No ITAR restrictions
The highly scalable COBALT product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly. It is available with a wide selection of power, interface options, thermal solutions, and mounting kits. The compact footprint and power-to-performance optimization make it the ideal solution for applications requiring high performance, reduced size-weight-power in an environmentally ruggedized platform. The design flexibility ensures fast time-to-market for many applications in the following segments: military, avionics, commercial avionics, mining, smart grid, homeland security, transportation (rail), and oil & gas.
Downloads
Datasheets
Cobalt 901
The highly scalable COBALT product family
is based on the COMe module Basic & Compact form factor module (Type
6) with a specialized carrier board assembly. It is available with a wide
selection of power, interface options, thermal solutions, and mounting
kits. The compact footprint and power-to-performance optimization
make it the ideal solution for applications requiring high performance,
reduced size-weight-power in an environmentally ruggedized platform.
The design flexibility ensures fast time-to-market for many applications in the following segments: military, avionics, commercial avionics,mining, smart grid, homeland security, transportation (rail), and oil & gas.
[ datasheet_cobalt-901.pdf, 1.01 MB, Aug.31.2017 ]
Manuals
Cobalt 901 User Manual
[restrictions apply]
The highly scalable COBALT product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly. It is available with a wide selection of power, interface options, thermal solutions, and mounting kits. The compact footprint and power-to-performance optimization make it the ideal solution for applications requiring high performance, reduced size-weight-power in an environmentally ruggedized platform.
[ 78500901_um_0-2.pdf, 2.71 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Dec.16.2025 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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