Boost AI Compuitng Performance at the Edge
3.5"-SBC-PTL is powered by hybrid-core-architecture Intel® Core™ Ultra 300 Series processors with upgraded iGPU and next-gen integrated NPU, delivering near-dGPU performance and next-level AI acceleration. It features 2.5 GbE with TSN and dTPM 2.0 support, ensuring real-time and secure communications. Finally, the board supports a board-to-board connector and a board-to-wire connector, providing additional I/O ports and extra graphics / AI acceleration card(s) respectively without the restriction of small form factor.
The board is available in both commercial- and industrial-grade operating temperature range as well as wide voltage input range to ensure reliable operation in different environments and diverse electrical conditions.
| Processor | Intel® Core™ Ultra 9 386H (4P+8E+4LPE, 18M, ~4.9GHz, 25→65W) Intel® Core™ Ultra 7 366H (4P+8E+4LPE, 18M, ~4.8GHz, 25→65W) 365 (4P+0E+4LPE, 12M, ~4.8GHz, 25→55W) 356H (4P+8E+4LPE, 18M, ~4.7GHz, 25→65W) 355 (4P+0E+4LPE, 12M, ~4.7GHz, 25→55W) Intel® Core™ Ultra 5 338H (4P+4E+4LPE, 18M, ~4.7GHz, 25→65W) 336H (4P+4E+4LPE, 18M, ~4.6GHz, 25→65W) 335 (4P+0E+4LPE, 12M, ~4.6GHz, 25→55W) 325 (4P+0E+4LPE, 12M, ~4.5GHz, 25→55W) 332 (2P+0E+4LPE, 12M, ~4.4GHz, 25→55W) 322 (2P+0E+4LPE, 12M, ~4.4GHz, 25→55W) |
| Main Memory | 2x DDR5 6400/7200 SO-DIMM up to 128 GByte |
| Graphics Controller | Intel® Arc™ B370 (Core™ Ultra 5 338H) Intel® Graphics (others) |
| Display | 1x eDP / LVDS (24-bit, 2-ch) 3x DP (2x Full-size DP on rear, 1x DP USB-C on rear) Quadruple Display support |
| Audio CODEC | TSI 92HD91B |
| Audio Interface | 1x Speaker-out (Stereo, by header) 1x Line-in (by header) 1x Line-out (by header) 1x Mic-in (by header) 1x S/PDIF Out (by header) |
| Ethernet Controller | Intel® I226-LM/IT |
| Ethernet | 2x 2.5 GbE LAN (RJ45 on rear) |
| USB | 3x USB 3.2 Gen 2 (2x Type A on rear, 1x Type C on rear w/ DP & PD 5 V / 3 A) 2x USB 2.0 (1x Type A on rear, 1x by header & +1 in case of no CAN Bus) |
| Serial Ports | 2x RS232/422/485 (by header) |
| DIO | 8x DIO (by header) |
| CAN BUS | 2x CAN Bus (by header, -2 in case of 2x USB 2.0 by header or on B2B) |
| Expansion | 1x M.2 Key B (Type 3042/3052/2280, w/ PCIe x2 / USB 2.0 / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0) 1x M.2 Key M (Type 2280, w/ PCIe x4) 1x SIM Card Holder (by header) 1x Board-to-board Connector (1x DDI, 2x MIPI CSI-2 (2x2 / 1x4), 1x PCIe x2 / 2x PCIe x1, 1x PCIe x1, 2x I3C, 1x UART, 1x GSPI, 2x USB 2.0 (optional)) 1x Board-to-wire Connector (1x PCIe x8 / 2x PCIe x4 (Core™ Ultra 9 386H / 7 366H / 7 356H only)) |
| Input Voltage | DC 9 V ~ 36 V |
| Power connector | 1x4-pin pitch 3.0 mm Wafer |
| BIOS | AMI uEFI BIOS |
| Watchdog | Programmable WDT to generate system reset event |
| System Monitoring | Voltages Temperatures |
| Real Time Clock | Processor integrated RTC |
| TPM | dTPM 2.0 (Infineon SLB 9672) |
| Cooling | 1x Wafer for Smart Fan |
| Operating System | Windows 11, Linux |
| Form Factor | ECX (146 mm x 105 mm / 5.75" x 4.13") |
| Operating Temperature | 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
| Storage Temperature | -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) |
| Humidity | 0 % ~ 95 % |
| EMC | CE Class B, FCC Class B, ICES Class B, UKCA Class B |
| Safety | UR (UL Recognized), CSA |
3.5"-SBC-PTL Datasheet
Revision 20251212, December 12, 2025
[ 3d5-sbc-ptl-datasheet-20251212.pdf, 2.91 MB, Dec.12.2025 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Dec.16.2025 ]
3.5" SBC Tech Spec Sheet
Revision 20250320, March 20, 2025
[ 3d5-sbc-tech-spec-sheet-20250320.pdf, 2.68 MB, Nov.05.2025 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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