erweiterter Temperaturbereich
3.5-SBC-APL V2.0 ist ein 3,5"-Einplatinen-Computer (SBC), ausgestattet mit Intel® Atom® E3900 Serie & Pentium® / Celeron® N- / J-Serie.
Höhere Leistung und Energieeffizienz
Der SBC-APL bietet bis zu 30 % mehr Verarbeitungs- und Grafikleistung und eine um 15 % höhere Energieeffizienz als Modelle mit Intel®-Prozessoren der vorherigen Generation.
Multifunktionale Integration
Zusätzlich unterstützt der SBC-APL einen integrierten M.2-Erweiterungssockel für USB, WWAN (3G, 4G), Satellitennavigation (GPS) und SSDs, der es Entwicklern ermöglicht, kompaktere oder dünnere eingebettete Geräte zu bauen.
Extreme Temperaturanwendungen
Erweiterte / Extremtemperaturmodelle sind ebenfalls erhältlich, die den Betrieb unter extrem hohen, niedrigen oder radikal schwankenden Temperaturen ermöglichen, was in industriellen Umgebungen üblich ist.
Processor | Intel® Atom® x7-E3950 (Quad Core, 2M Cache, 1.60 / 2.00 GHz, FCBGA1296, 12 W TDP) Intel® Atom® x5-E3940 (Quad Core, 2M Cache, 1.60 / 1.80 GHz, FCBGA1296, 9.5 W TDP) Intel® Atom® x5-E3930 (Dual Core, 2M Cache, 1.30 / 1.80 GHz, FCBGA1296, 6.5 W TDP) Intel® Pentium® N4200 (Quad Core, 2M Cache, 1.10 / 2.50 GHz, FCBGA1296, 6 W TDP) Intel® Celeron® J3455 (Quad Core, 2M Cache, 1.50 / 2.30 GHz, FCBGA1296, 10 W TDP) Intel® Celeron® N3350 (Dual Core, 2M Cache, 1.10 / 2.40 GHz, FCBGA1296, 6 W TDP) |
Main Memory | 2x DDR3L 1867 1.35 V SO-DIMM |
Graphics Controller | Intel® HD Graphics 505 (for mdoels w/ Atom® x7, Pentium®) Intel® HD Graphics 500 (for models w/ Atom® x5, Celeron®) |
Display | 1x LVDS (18/24-bit, 1/2-ch, 1920 x 1200 @ 60 Hz) 1x DP 1.2 (4096 x 2160 @ 60 Hz, on rear) 1x HDMI 1.4 (3840 x 2160 @ 30 Hz, on rear) Triple display support |
Audio Controller | Realtek ALC888S |
Audio | 1x Speaker-out (Stereo, 3 W, by header) 1x Line-in (by header, extreme temperature model excluded) 1x Line-out (by header, extreme temperature model excluded) 1x Mic-in (by header, extreme temperature model excluded) |
Ethernet | 2x GbE LAN (RJ45 on rear, Intel® I210-AT) |
USB | 4x USB 3.2 Gen 1 (Type A on rear) 2x USB 2.0 (by header, default) 3x USB 2.0 (by header, only for 3.5”-SBC-APL-6-E3950 V 2.0) |
Serial | 2x RS232/422/485 (by wafer, auto fl ow control function for RS485) 4x RS232 (by wafer) |
Available I/Os | 8x DIO (by header) |
SATA | 1x SATA3.0 |
Expansion | 1x Micro SD Cage (on front) 1x mPCIe (full size) 1x M.2 Key B (2242, w/ USB 2.0 / SATA / PCIe x1, default) 1x M.2 Key B (2242, w/ SATA / PCIe x1, only for 3.5”-SBC-APL-6-E3950 V 2.0) 1x SIM Card Cage (by wafer, switchable between mPCIe and M.2) |
Input Voltage | DC 12 V |
Power connector | 1x 4-pin Wafer (Straight & Right Angle dual-footprint) |
BIOS | AMI uEFI BIOS w/ 128 Mb SPI Flash |
Watchdog | Programmable WDT to generate system reset event |
Real Time Clock | Processor integrated RTC |
Cooling | 1x Wafer for System Smart Fan |
Operating System | Windows 10, Linux |
Mechanical Dimensions | SBC (146 mm x 105 mm / 5.75” x 4.13”) |
Operation Temperature | 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard) -20 °C ~ 70 °C / -4 °F ~ 158 °F (Extended) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
Humidity | 0 % ~ 95 % |
Compliance | CE Class B, FCC Class B |
3.5-SBC-APL V2.0 Datasheet
Revision 20230815, August 15, 2023
[ kontron-3d5-sbc-apl-v2d0-datasheet-20230815.pdf, 2.92 MB, Aug.15.2023 ]
3.5-SBC-APL V2.0 User Guide
Revision 2.7, November 9, 2023
[ kontron-3d5-sbc-apl-v2d0-user-guide-rev-2d7-2023-11-09.pdf, 1.94 MB, Nov.10.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
3.5"-SBC-APL V2.0 Creates HMI for Picosecond Laser Tattoo Removal Machine
Revision 20200703, July 3, 2020
[ application-story-picosecond-laser-20200703.pdf, 2.89 MB, Sep.22.2020 ]
Tech Specs SBC
(Release Candidate)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Oct.14.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
COM_Port Cable 1064-2427 |
D-SUB 9P (männlich) bis 1x10P 1,25 | ||
DIO Cable 1065-3137 |
D-SUB-9P(Female) to 1x10P 1.25 pitch, L=200mm | ||
2 Ports USB 2.0 Cable 1064-2429 |
USB (female) ×2 to 2×5P 2.54 pitch, L=250 mm | ||
SATA Cable with Lock 1064-2431 |
SATA Cable with Lock, 1X7P (1.27 pitch), L=460 mm | ||
SIM Card Holder Kit 1064-2434 |
with SIM card holder x1, cable x1,and screws x4 | ||
Audio Cable 1064-2432 |
2x6P 2.54 pitch to ear phone jack x3 3.5 pitch, L=350 mm | ||
DC Jack Cable 1064-2433 |
2,5-Gleichstrombuchse mit 2-mm-Mutter und 0,5-mm-Unterlegscheibe im Raster 1 x 4P 3,0 | ||
Heatsink - Cooling Solution E-Series 1067-5540 |
Heatsink E-Series Variant | ||
Heatsink - Cooling Solution N-Series 1067-5537 |
Heatsink N-Series Variant | ||
SATA Power Cable 1064-2430 |
SATA Power Cable, SATA 1x15P Pitch:1.27mm to PH 2.0 HSG 1x4P 2.0pitch, L=460mm |
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