Datasheet Smartcase™ S730
350.39 KB | April 21, 2026
SMARTCASE™ S730
Chassis Kit Solution for D3713-V/R, D3723-R & K3931-N mITX
Product Information
The SMARTCASE™ S730 is designed for the D3713-V/R & D3723-R mITX motherboard family, which support the AMD Ryzen™ Embedded V/R1000 & R2000 processors series as well as the new K3931-N based on Intel Alder Lake N processors. Like the whole SMARTCASE™ family, the S730 appears in a classy and clear design and now even includes a dual front USB 3.2 Gen 1 connector for easier handling. In addition, it can be cooled actively or passively. With a wide range DC-in from 8 to 34V, this kit solution meets requirements of many different applications. The SMARTCASE™ S730 can be used in horizontal or vertical mode.
Technical data
| Dimensions (W x H x D) | 250 x 52 x 191 mm (W x H x D) |
|---|---|
| Colour | black |
| Weight | ≈ 1 kg |
| Operating Temperature | Passive heatsink (fanless; D3713-V/R or D3723-R):-10 °C ... +35 °C (max. 15 W TDP, vertical/horizontal position) *)-10 °C ... +40 °C (max. 12 W TDP, vertical position only) *) Passive heatsink (fanless; K3931-N):-10 °C ... +40 °C (max. 15 W TDP, horizontal position) *)-10 °C ... +45 °C (max. 15 W TDP, vertical position) *) Active heatsink (with Fan):-10 °C ... +45 °C (max. 35 W TDP, vertical/horizontal position) *) |
| Humidity | 5 % - 85 % relative humidity (non-condensing) |
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