3U cPCI Power Backplanes

The 3U cPCI Power Backplanes from Kontron Hartmann-Wiener are robust, compact power-distribution boards compatible with CompactPCI (PICMG) systems.

  • Support for compact 1–4 slot cPCI systems
  • Dual connector options: DIN 41612 or P47
  • PICMG 2.0 and 2.11 compatibility
  • Parallel chaining of multiple backplanes
  • Wide operating temperature range (–40 °C … +85 °C)
Produkt Vorschaubild

Produktinformationen

They support 1 to 4 slots and can be outfitted with DIN 41612 or P47 power connectors. These backplanes comply with PICMG 2.0 and PICMG 2.11 standards, enabling parallel chaining of multiple boards.

The 3U cPCI Power Backplanes act as power distribution hubs in CompactPCI systems. They align with established PICMG power standards (PICMG 2.0 / 2.11), allowing seamless integration with standard cPCI systems. The use of DIN 41612 or P47 connectors gives flexibility in power source selection. Their design allows multiple backplanes to be chained in parallel, making them scalable for larger systems. Even in harsh environments, due to wide temperature tolerance (–40 °C to +85 °C) and high humidity tolerance, they maintain reliable operation.

Product Image 1

Technische Daten

FeaturesForm Factor: 3U height Slots: 1, 2, 3, or 4 cPCI slots Base Spec: PICMG 2.0 / PICMG 2.11 Power Connector Types: DIN 41612 type M or P47 plug-in connectors Parallel Support: Yes — supports parallel connection of multiple backplanes Operating Temperature: –40 °C to +85 °C Relative Humidity: 90%, non-condensing Material / Flame Rating: FR-4, UL 94 V-0 Key Part Numbers / Variants:   • 3U, 4-slot, P47 connector (ECO)   • 3U, 3-slot, P47 connector (ECO)   • 3U, 2-slot, P47 (L2) with 3-pin MATE-N-LOK connector   • 3U, 1-slot, P47 (L1)   • 3U, 1-slot, DIN41612 type M   • 3U, 1-slot, DIN41612 type M (reversed mounting)

Downloads

Datenblatt

PDF

3U cPCI Power Backplanes Datasheet

18.12 MB | 26. März 2026

Handbücher

PDF

General Safety Instruction

628.88 KB | 26. März 2026

Service

PDF

Kontron Services Brochure

8.9 MB | 26. März 2026

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