COMe-cAL6 (E2)

COM Express® compact Type 6 with Intel® Atom® E3900 Series, Pentium® and Celeron® Processors
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Specifications
  • Low-power – performance/watt optimized form factor solution
  • Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
  • Triple display support
  • Up to 5x PCIe lanes
  • 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature
Download Datasheet

The COMe-cAL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. A broad range of module variants, based on five different processor types, make up the COMe-cAL6 portfolio. Versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications.

Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.

 

 

Features

Compliance COM Express® compact, Pin-out Type 6 - COM.0 R3.0
Dimensions (H x W x D) 95 x 95 mm
CPU COMe-cAL6 E2:
Intel® Atom® x7-E3950, 4C, 1.6 / 2.0 GHz, 12 W TDP
Intel® Atom® x5-E3940, 4C, 1.6 / 1.8 GHz, 9.5 W TDP
Intel® Atom® x5-E3930, 2C, 1.3 / 1.8 GHz, 6.5 W TDP
COMe-cAL6:
Intel® Pentium® N4200E, 4C, 1.1 / 2.5 GHz, 6 W TDP
Intel® Celeron® N3350E, 2C, 1.1 / 2.4 GHz, 6 W TDP
Chipset Integrated SoC
Main Memory Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
Graphics Controller Intel HD Gfx Gen9: 1x LVDS/eDP (3840 x 2160 @ 60 Hz)
2x DP (++) on DDI1/DDI2 up to 4K
Ethernet Controller Intel® I210IT / I210AT (I211AT)
Ethernet 10/100/1000 MBit Ethernet
Hard Disk 2x SATA 6Gb/s, SDIO Interface (shared with GPIO)
Flash Onboard Build option:

- up to 84 GByte eMMC pSLC

- up to 256 GByte eMMC TLC
PCI Express / PCI support 3x PCIe x1
on request:
- 5x PCIe x1: w/ LAN, w/ PCIe hub
- 4x PCIe x1: w/o LAN, w/o PCIe hub
Panel signal DDI 1/2: DP++, LVDS: Dual Channel up to 48-bit or eDP on request
USB 4x USB 3.0/2.0, 4x USB 2.0 - (3x USB 2.0 w/ Security Chip)
Serial 2x serial interface (RX/TX only)
Audio Intel® High Definition Audio
Common Features SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
BIOS AMI Aptio V
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Options 5x PCIe x1 configuration w/ PCI hub
eMMC Flash option (up to 84GByte pSLC, 256GByte TLC)
eDP instead of LVDS
General Purpose SPI instead of Boot SPI, AES-NI, USB client
Power Management ACPI 5.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
Special Features POSCAP capacitors, Trusted Platform Module TPM 2.0, microSD card socket
4k Resolutions, GPIO/SDIO Switch, Industrial grade temperature
Operating System Windows 10 Enterprise, Windows 10 IoT, Linux, VxWorks
Temperature COMe-cAL6 - commercial temperature:
0 °C to +60 °C operating, -30 °C to +85 °C non-operating
COMe-cAL6 E2 - industrial temperature:
-40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Supported Modules COMe-cAL6 / COMe-cAL6 E2

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-cAL6 (E2)
[ come-cal6_datasheet.pdf, 2.25 MB, Dec.01.2022 ]

Manuals

COMe-cAL6 (E2) User Guide
Rev. 2.1 Aug. 23, 2023
[ come-cal6_user-guide_rev-2-1_2023-08-23.pdf, 1.95 MB, Aug.23.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

Tech Spec Sheet

COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 2.96 MB, Nov.02.2023 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMe-cAL6 E2 E3930
36024-0000-13-5
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Atom® x5 E3930, industrial temperature  
COMe-cAL6 E2 E3940
36024-0000-16-5
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Atom® x5 E3940, industrial temperature  
COMe-cAL6 E2 E3950
36024-0000-16-7
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Atom® x7 E3950, industrial temperature  
COMe-cAL6 E2 E3950 32S PCIe
36024-0032-16-7
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Atom® x7 E3950, 32GB pSLC eMMc, PCIe Hub, industrial temperature  
COMe-cAL6 N3350
36023-0000-11-2
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Celeron® N3350,commercial grade  
COMe-cAL6 N4200
36023-0000-11-4
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Pentium® N4200, commercial grade  

Accessories

COMe Eval Carrier2 T6
38116-0000-00-5
COMe Eval Carrier2 T6 COM Express® Eval Carrier2 Type 6 with 5mm COMe connector more
COMe Ref.Carrier-i T6 TMIP
38115-0000-00-0
COM Express® Reference Carrier-i Type 6 Thin-MiniITX Professional  
COMe Active Uni Cooler (w/o HSP)
36099-0000-99-0
COM Express® Universal Active Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <20W)  
COMe Passive Uni Cooler (w/o HSP)
36099-0000-99-1
COM Express® Universal Passive Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <10W)  
COMe Passive Uni Cooler Slim (w/o HSP)
36099-0000-99-3
COM Express® Universal Passive Cooler low profile for Heatspreader Mounting (95x95x10 mm) 90° fin direction mounting option  
KAB-HSP 200mm
96079-0000-00-0
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm  
KAB-HSP 40mm
96079-0000-00-2
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 40mm  
COMe Mount KIT 8mm 1set
38017-0000-00-0
COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions  
COMe Mount Kit 5mm 100sets
38017-0100-00-5
COM Express® Mounting Kit 5mm 100 sets  
COMe Mount Kit 5mm 1set
38017-0000-00-5
COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions  
COMe Mount Kit 8mm 100sets
38017-0100-00-0
COM Express® Mounting Kit 8mm 100sets  
HSP COMe-cAL6 (E2) Thread
36024-0000-99-0
Heatspreader for COMe-cAL6/COMe-cAL6 E2, threaded mounting holes  
HSP COMe-cAL6 (E2) Through
36024-0000-99-1
Heatspreader for COMe-cAL6/COMe-cAL6 E2, through holes  
DDR3L-1866 SODIMM 4GB E2_COM
97015-4096-19-2
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900, industrial temperature -40°C to +85°C  
DDR3L-1866 SODIMM 4GB_COM
97015-4096-19-0
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900  
DDR3L-1866 SODIMM 8GB E2_COM
97015-8192-19-2
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900, industrial temperature -40°C to +85°C  
DDR3L-1866 SODIMM 8GB_COM
97015-8192-19-0
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900  


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