IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh-ccAS New

COM-HPC Client Size C module based on the 12th and 13th Gen Intel® Core™ S processors

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Specifications

Up to 16 cores (TDP range: 35 W-65 W) & 24 threads
Memory: Max 128 GByte DDR5 via 4x SODIMMs, ECC and non-ECC
16x PCIe Gen 5.0 lanes (for high performance CPUs) + 8x PCIe Gen 4.0 lanes + 6x PCIe Gen 3.0 lanes
3x DDI + 1x eDP

Download Datasheet

The COMh-ccAS is a new COM-HPC^® client module with increased graphics and computing power for high-performance computing, based on the 12th Gen Intel^® Core™ S processors (S-series, former codename Alder Lake S).

The COMh-ccAS is equipped without CPU (socketed). It can now also be used with the 13th Gen Intel® Core™ desktop processor. Thanks to the socketed Intel® hybrid processors of the 13th generation, exceptionally high multi-thread performance can be achieved with 24 processor cores and 32 threads at up to 65 W TDP (on board).

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Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

COMh-ccAS
[ comh-ccas_datasheet.pdf, 766.78 KB, Aug.09.2023 ]

Manuals

COMh-ccAS User Guide
[ comh-ccas_userguide0-3.pdf, 1.46 MB, Jul.10.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

White Papers

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

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