COMe-bID7 New

COM Express® basic Type 7 with Intel® Xeon® D-1700 processor family
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Specifications
  • Server-grade platform
  • Quad 10 GbE interfaces
  • High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
  • Up to 1 TByte NVMe SSD onboard
  • Industrial grade versions
Download Datasheet

The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.

The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.

The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.

Features

Compliance COM Express® basic, Pin-out Type 7
Dimensions (H x W x D) 125 x 95 mm
CPU Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz
Intel® Xeon® D-1735TR, 59W, 8 core, 2.2GHz
Intel® Xeon® D-1718T, 46W, 4 core, 2.6GHz
Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp.
Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp.
Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp.
Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp.
see complete list in COMe-bID7 datasheet
Chipset Integrated in SoC
Main Memory 2x DDR4 SODIMM for up to 64 GByte ECC / non ECC
on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC
Graphics Controller -
Ethernet Controller Intel® I225LM/IT
Intel® Quad 10GbE LAN integrated in SoC
Ethernet 1x 1/2.5 Gb (1/2.5 GBASE-T)
4x 10Gb (10 GBASE-KR)
Storage 2x SATA3, 6Gb/s
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI Express 16x PCIe Gen4 (1 x16, 2 x8, 4 x4)
16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
Display -
USB 4x USB 3.0 (4x USB 2.0)
Serial 2x serial interface (RX/TX only)
Audio -
Special Features TPM 2.0, NVMe SSD, additional 3rd and 4th SODIMM socket
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
BIOS AMI UEFI
Operating System Linux, Windows 10 IoT Enterprise, Windows Server 2022
Temperature Commercial temperature: 0 °C to +60 °C operating,
-30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating,
-40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Supported Modules COMe-bID7 xxxxx commercial grade
COMe-bID7 E2 xxxxx industrial grade

Downloads

Datasheets

Datasheet COMe-bID7
[ come-bid7_datasheet.pdf, 1.52 MB, May.06.2022 ]

Manuals

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

Tech Spec Sheet

Tech Specs COM EXPRESS® basic
[ tech-spec_comexpress-basic_web.pdf, 8.95 MB, Jun.10.2022 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMe-bID7 E2 D-1746TER
68009-0000-46-1
COMe-bID7 E2 D-1746TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1746TER, 67/56W, 10 core, 2.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature  
COMe-bID7 E2 D-1747NTE
68009-0000-47-2
COMe-bID7 E2 D-1747NTE COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1747NTE, 80W, 10 core, 2.5GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature  
COMe-bID7 E2 D-1732TE
68009-0000-32-1
COMe-bID7 E2 D-1732TE COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1732TE, 52W, 8 core, 1.9GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature  
COMe-bID7 E2 D-1715TER
68009-0000-15-1
COMe-bID7 E2 D-1715TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1715TER, 50W, 4 core, 2.4GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature  
COMe-bID7 D-1749NT
68008-0000-49-2
COMe-bID7 D-1749NT COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®D-1749NT, 90W, 10 core, 3.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket  
COMe-bID7 D-1735TR
68008-0000-35-1
COMe-bID7 D-1735TR COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1735R, 59W, 8 core, 2.2GHz, 4x 10GBASE-KR, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket  
COMe-bID7 D-1718T
68008-0000-18-1
COMe-bID7 D-1718T COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1718T, 46W, 4 core, 2.6GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket  

Accessories

COMe Eval Carrier T7 Gen2
COMe Eval Carrier T7 Gen2 COM Express® Eval Carrier Type 7 more
HSP COMe-bID7 (E2) THREAD
68009-0000-99-0
HSP COMe-bID7 (E2) THREAD Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes  
HSP COMe-bDV7 (E2) THROUGH
68009-0000-99-1
HSP COMe-bDV7 (E2) THROUGH Heatspreader for COMe-bID7 commercial and E2, through holes  
HSK COMe-basic active (w/o HSP)
38025-0000-99-0C05
HSK COMe-basic active (w/o HSP) Active Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP  
HSK COMe-basic passive (w/o HSP)
38025-0000-99-0C06
HSK COMe-basic passive (w/o HSP) Passive Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP  
DDR4-3200 SODIMM 8GB ECC_BID7
97030-0832-BID7
DDR4-3200 SODIMM 8GB ECC_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC  
DDR4-3200 SODIMM 16GB ECC_BID7
97030-1632-BID7
DDR4-3200 SODIMM 16GB ECC_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC  
DDR4-3200 SODIMM 32GB ECC_BID7
97030-3232-BID7
DDR4-3200 SODIMM 32GB ECC_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC  
DDR4-3200 SODIMM 8GB ECC E2_BID7
97031-0832-BID7
DDR4-3200 SODIMM 8GB ECC E2_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C  
DDR4-3200 SODIMM 16GB ECC E2_BID7
97031-1632-BID7
DDR4-3200 SODIMM 16GB ECC E2_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C  
DDR4-3200 SODIMM 32GB ECC E2_BID7
97031-3232-BID7
DDR4-3200 SODIMM 32GB ECC E2_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C  


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