COMe-bEP7 New
COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors
Specifications
- Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
- Quad 10GbE interfaces
- 4 x SODIMM sockets (up to 128GB DDR4 memory) on request
- Industrial grade versions
The COM Express® module COMe-bEP7 based on AMD EPYC™ 3000 series processors extends Kontron’s product family of server-grade COM platforms. The COMe-bEP7 is headless and a cost efficient option for applications requiring high processing power such as Medical Imaging and Servers.
The COMe-bEP7 is a high performance module with scalable performance up to 16 cores. The module supports an optional four SODIMM sockets with up to 128GB memory as well as four 10Gb Ethernet ports. The COMe-bEP7 is offered for either commercial or extended temperature ranges.
Features
| Compliance | COM Express® Basic, Pin-out Type 7 |
| Dimension (H x W) | 95 x 125 mm |
| CPU | Commercial Temperature: AMD E3101 4C/4T, 35W TDP, 2.1GHz (2.9GHz) AMD E3151 4C/8T, 45W TDP, 2.7GHz (2.9GHz) AMD E3201 8C/8T, 30W TDP, 1.5GHz (3.1GHz) AMD E3251 8C/16T, 55W TDP, 2.5GHz (3.1GHz) AMD E3351 12C/24T, 65-80W TDP, 1.9GHz (3.0GHz) AMD E3451 16C/32T, 85-100W TDP, 2.45GHz (3.0GHz) Industrial Temperature: AMD E3255 8C/16T, 30-55W TDP, 2.0/2.5GHz (3.1GHz) |
| Main Memory | SP4r2 (single-die): 2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory SP4 (dual-die): 2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory 4x DDR4 SODIMM for up to 128GB on request |
| Ethernet Controller | Internet i210 |
| Ethernet | 4x 10GbE KR/SFI |
| Hard Disk | 2x SATA |
| PCI Express / PCI support | SP4r2 (single-die): 24x PCIe Gen 3.0 SP4 (dual-die): 32s PCIe |
| USB | 4x USB 3.1, 4x USB 2.0 |
| Serial | 2x serial interface |
| Common Features | SPI Flash, LPC, SMB, Dual Staged Watchdog, RTC On request for SP4 (dual-die): NVMe Support |
| Power Management | OS ACPI PM support for Critical Shutdown |
| Power Supply | ATX, 8.5V- 20 V Wide Range Single Supply |
| Special Features | TPM |
| Humidity | 93% relative Humidity at 40°C, non-condensing |
| Temperature | Commercial Grade Version: 0°C to 60°C Industrial Grade Version: -40°C to 85°C |
| BIOS | AMI UEFI |
| Operating System | Linux x64 – Ubuntu Windows Server x64 2016 |
| Supported Modules | COMe-bEP7 xxxxx commercial grade COMe-bEP7 E2 xxxxx industrial grade |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Use Cases
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Datasheets
Datasheet COMe-bEP7
[ come-bep7_datasheet.pdf, 1.92 MB, Apr.13.2022 ]
Manuals
COMe-bEP7 User Manual
[ come-bep7_user_manual_5-19-2022.pdf, 3.39 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 23.6 MB, Mar.07.2023 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Variants
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COMe-bEP7 E3101 68010-0000-01-1 |
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COMe-bEP7 E3101 | |
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COMe-bEP7 E3151 68010-0000-51-1 |
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COMe-bEP7 E3151 | |
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COMe-bEP7 E3201 68010-0000-01-2 |
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COMe-bEP7 E3201 | |
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COMe-bEP7 E3251 68010-0000-51-2 |
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COMe-bEP7 E3251 | |
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COMe-bEP7 E3351 68010-0000-51-3 |
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COMe-bEP7 E3351 | |
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COMe-bEP7 E3451 68010-0000-51-4 |
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COMe-bEP7 E3451 | |
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COMe-bEP7 E3451 with 4 SODIMM sockets 68010-0000-61-4 |
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COMe-bEP7 E3451 with 4 SODIMM sockets |
Accessories
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COMe Mount Kit 5mm 1set 38017-0000-00-5 |
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COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions | |
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COMe Mount Kit 5mm 100sets 38017-0100-00-5 |
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COM Express® Mounting Kit 5mm 100 sets | |
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COMe Mount KIT 8mm 1set 38017-0000-00-0 |
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COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions | |
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COMe Mount Kit 8mm 100sets 38017-0100-00-0 |
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COM Express® Mounting Kit 8mm 100sets | |
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ADA-COMe-Height-dua 38019-0000-00-0 |
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ADA-COMe-Height-dua | |
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KAB-HSP 200mm 96079-0000-00-0 |
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Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm | |
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COMe Eval Carrier T7 Gen2
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COM Express® Eval Carrier Type 7 | more |
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COMe Eval Carrier T7
68300-0000-00-0 |
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COM Express® Eval Carrier Type 7 | more |
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HSP COMe-bEP7 THREADED 68010-0000-99-0 |
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Heatspreader for COMe-bEP7, threaded mounting holes | |
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HSP COMe-bEP7 THROUGH 68010-0000-99-1 |
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Heatspreader for COMe-bEP7, through mounting holes | |
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DDR4-2666 8 GB non-ECC 97020-0827-BEP7 |
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Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 16 GB non-ECC 97020-1627-BEP7 |
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Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 32 GB non-ECC 97020-3227-BEP7 |
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Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 16 GB non-ECC 97021-1627-BEP7 |
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Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: -40 °C - 85 °C |
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DDR4-2666 8 GB non-ECC 97021-0827-BEP7 |
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Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: -40 °C - 85 °C |
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DDR4-2666 32 GB non-ECC 97021-3227-BEP7 |
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Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: -40 °C - 85 °C |
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DDR4-2666 8 GB ECC 97030-0827-BEP7 |
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Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 16 GB ECC 97030-1627-BEP7 |
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Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 32 GB ECC 97030-3227-BEP7 |
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Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: 0°C- 60 °C |
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DDR4-2666 8 GB ECC 97031-0827-BEP7 |
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Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: -40 °C - 85 °C |
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DDR4-2666 16 GB ECC 97031-1627-BEP7 |
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Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: -40 °C - 85 °C |
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DDR4-2666 32 GB ECC 97031-3227-BEP7 |
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Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: -40 °C - 85 °C |
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