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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Home / 6U VME430-6023
6U VME430-6023
21-slot 6U VME/VME430 Chassis with modular architecture, 1U airflow chamber, and enhanced cooling.
Specifications
- Mechanics: 6U × 160 mm, IEEE 1101.10 compliant, EMC/ESD-protected
- Slots: 21 VME/VME430 (J1/Jaux/J2)
- Power Supply: up to 1000 W, microprocessor-controlled
- Ripple: typ. < 10 mV(pp) or < 3 mV(rms)
- Interfaces: Ethernet, RS232, CAN-bus
- Cooling: fan tray with air compression chamber
The VME430-6023 Chassis series provides the latest generation of 19″ VME/VME430 packaging systems with advanced cooling and modularity. It features a unique 1U air compression chamber between the fan tray and bus area, optimizing airflow across all slots. The system integrates a bottom-mounted power supply behind the fan tray, keeping the rear side of the backplane fully accessible. Designed for high-energy physics and demanding research environments, the VME430-6023 ensures high stability, efficient cooling, and complete monitoring via Ethernet, RS232, and CAN-bus.
Features
| Features | Modular construction: bin, fan tray, PSU with 1U airflow chamber Backplane: 21-slot monolithic VME430, 10-layer PCB, daisy-chain, active termination Cooling: Optimized airflow with temperature-controlled fans Interfaces: Ethernet, RS232, CAN-bus for crate-level monitoring Protection: Overvoltage, undervoltage, overload, and fan fail detection Compliance: CE, EN 60950, ISO 380, VDE 0805, UL 1950 Operation: 0–50 °C without derating |
Downloads
Datasheets
6U VME430 6023 Full Size Chassis
[ 6u-vme430-6023-full-size-chassis.pdf, 329.17 KB, Aug.30.2025 ]
Manuals
General Safety Instruction
[ vpx-360-manual.pdf, 5.67 MB, Dec.02.2025 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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