COMe-bID7 Neu
COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family
Mouseover Zoom loading...
Spezifikationen
- Server-grade platform based on Intel® Xeon® D-1700 / D-1800 processor family
- Quad 10 GbE interfaces
- High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.
The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.
The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.
Eigenschaften
| Compliance | COM Express® basic, Pin-out Type 7 - COM.0 R3.1 by default, COM.0 R3.0 on request |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz Intel® Xeon® D-1735TR, 59W, 8 core, 2.2GHz Intel® Xeon® D-1712TR, 40W, 4 core, 2.0GHz Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp. Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp. Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp. Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp. see complete list in COMe-bID7 datasheet |
| Chipset | Integrated in SoC |
| Main Memory | 2x DDR4 SODIMM for up to 64 GByte ECC (non ECC on request) on request: 4x DDR4 SODIMM for up to 128 GByte ECC (non ECC on request) |
| Graphics Controller | - |
| Ethernet Controller | Intel® I225LM/IT Intel® Quad 10GbE LAN integrated in SoC |
| Ethernet | 1x 1/2.5 Gb (1/2.5 GBASE-T) 4x 10Gb (10 GBASE-KR) |
| Storage | 2x SATA3, 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 16x PCIe Gen4 (1 x16, 2 x8, 4 x4) 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) |
| Display | - |
| USB | 4x USB 3.0 (4x USB 2.0) |
| Serial | 2x serial interface (RX/TX only) |
| Audio | - |
| Special Features | TPM 2.0, NVMe SSD, additional 3rd and 4th SODIMM socket |
| Power Management | ACPI 6.0 |
| Power Supply | Commercial temperature: 8.5 V - 20 V Wide Range Industrial temperature: 12 V DC +/- 5% |
| BIOS | AMI UEFI |
| Operating System | Linux, Windows 10 IoT Enterprise, Windows Server 2022 |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | COMe-bID7 xxxxx commercial grade COMe-bID7 E2 xxxxx industrial grade |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bID7
[ come-bid7_data-sheet.pdf, 517.06 KB, Feb.19.2024 ]
Manuals
COMe-bID7 User Guide
[ come-bid7_user-guide_rev-1-6_2024-0216_w2016.pdf, 3.64 MB, Feb.19.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 4.8 MB, May.26.2021 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
|
COMe Eval Carrier T7 Gen2
|
|
COM Express® Eval Carrier Type 7 | more |
|
HSP COMe-bID7 (E2) THREAD 68009-0000-99-0 |
Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes | ||
|
HSP COMe-bID7 (E2) THROUGH 68009-0000-99-1 |
Heatspreader for COMe-bID7 commercial and E2, through holes | ||
|
HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
|
HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
|
DDR4-3200 SODIMM 8GB ECC_BID7 97030-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
|
DDR4-3200 SODIMM 16GB ECC_BID7 97030-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
|
DDR4-3200 SODIMM 32GB ECC_BID7 97030-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
|
DDR4-3200 SODIMM 8GB ECC E2_BID7 97031-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
|
DDR4-3200 SODIMM 16GB ECC E2_BID7 97031-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
|
DDR4-3200 SODIMM 32GB ECC E2_BID7 97031-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C |
zurück
Infoanfrage
Produktvergleich (bis zu 5 Produkte)
Aktuell sind keine Produkte zum Vergleich selektiert.
Services
Take advantage of our full-service approach
To find out more about our services go to services pages
Customer Section
This section is exclusively for Kontron Customers. After registering you will gain access to
BIOS images, product change notifications (PCNs), 3D models for CAD, and software development
tools.
Click below to login or register.
*Please allow 24 hours to process your confirmation. You will be informed via email when your access to
the customer section is granted.
Click below to login or register.
Login or
register here
register here
*Please allow 24 hours to process your confirmation. You will be informed via email when your access to
the customer section is granted.
