COM-HPC®/SERVER – NEXTGEN Server CPU

Planned for Q4/2021
Spezifikationen
Bald verfügbar
  • Size D form factor – 160 x 160 mm
  • NextGen HCC (high core count) X86 Server platform
  • Up to 20 cores, processor TDP up to 120W
  • 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
  • Up to 8x LAN Ports for various configurations: 100GbE / 2x 50GbE / 4x 25GbE + 4x 10GbE
  • Memory: Max 512GB DIMM-DDR4 with 4x DIMMs
  • Optional onboard storage NVMe
  • Industrial temperature versions
  • Embedded management controller

Developed under the auspices of PICMG, this new specification pushes the performance level for Computer-on-Modules (COMs) to levels not before seen.

Learn more about the new COM standard: COM-HPC Introduction.

 

Downloads

Manuals

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

White Papers

COM-HPC Whitepaper [eingeschränkter Download]
This Whitepaper overviews the key features of the new COM-HPC® standard and Kontron’s initial COM-HPC® products, while also assessing COM Express® versus COM-HPC® and the future implications for COM Express® - particularly COMe Type 7 - for which Kontron remains a major influencer and supporter.

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Weitere Downloads

Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section



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