COMh-caRP
COM HPC/Client module size A with 13th Generation Intel® Core™ Processors
Specifications
Coming soon- Up to 64 GByte DDR5 memory
- Up to 2.5Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade
The COMh-caRP is based on 13th Gen Intel® Core™ processors (former codename Raptor Lake U/P/H. They offer a significant performance increase compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture. The 13th generation is particularly well suited for connected IoT applications. A new embedded controller ensures improved availability, flexibility and system openness. The Module provides essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN), and extended temp ranges of -40C to +85C Tjmax.
All features are perfect for high-performance computing in resource-intensive and demanding areas such as networking, automation and measurement and customers profit from longterm availability
Features
| Compliance | COM HPC® Client 2x 400 pin connector |
| CPU | Intel® 13th Generation CoreTM family For details see table (CPU variants) given below |
| Chipset | lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub |
| Main Memory | 2x DDR5 SODIMM dual channel up to 64 GByte non ECC |
| Graphics Controller | Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K) |
| Ethernet Controller | Intel® i226 |
| Ethernet | Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU) |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express / PCI support | 1x 8 PCIe Gen 5.0 (Raptor Lake H-Series, 35-45 W) 2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0 Optional 1x PCIe for BMC |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI |
| USB | 2x USB 4.0/ Thunderbolt TM; 2x USB 3.2; 8x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | 4x Sound wire, I2S (HW option: Option HD Audio instead of 2x sound wire) |
| Special Features | Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI UEFI |
| Operating System | Windows®10, Linux, VxWorks |
| Temperature | Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
技术参数
COMh-caRP
[ comh-carp_datasheet.pdf, 2.65 MB, Sep.14.2023 ]
参考手册
COMh-caRP User Guide
[ comh-carp_userguide_0-3.pdf, 1.46 MB, Aug.02.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
白皮书
The new Standard COM-HPC – Delivering future proofed power and connectivity
[restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.
While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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