Aaeon, Adlink, Advantech and Kontron jointly release nanoETXexpress 1.0 specification

Small COM Express™ type 1 form factor gains strong momentum

Eching/Nuremberg, Germany, March 03, 2009 - The small Computer-on-Modules form factor nanoETXexpress (84 mm x 55 mm), originally initiated by Kontron, is gaining momentum and acceptance in the market. The embedded Computer-on-Modules vendors Aaeon, Adlink and Advantech together with Kontron have jointly released revision 1.0 of the nanoETXexpress specification, which now includes SDVO support. They will present the nanoETXexpress form factor to the PICMG® consortium for incorporation into one of the next COM Express™ releases under the proposed neutral name “Ultra”.

Future-proof design, maximum reliability and longevity are just some of many high quality features of the nanoETXexpress form factor that have inspired Aaeon, Adlink, Advantech and Kontron to work together on revision 1.0 and push for its incorporation as “Ultra” - along with the slightly larger “Compact” module (95 x 95mm) - into the COM Express™ specification. Currently, the COM Express™ specification includes only the “Basic” (95 x 125mm) and “Extended” (110 x 155mm) form factors.

“We support the “Ultra” form factor because it fits perfectly into our product portfolio. We have already implemented the Intel® Atom™ processor on our COM-U15 COM Express™ Computer-on-Module. The step to implementing the nanoCOM-U15 was therefore easy”, explains Peter Yang, AAEON Product Manager ECD, responsible for Computer-on-Modules at AAEON.

"In the market for Computer-on-Modules oriented designs we have seen how customers have shown a clear preference towards a single open standard: PICMG's® COM Express™. By proposing this new "Ultra" small form factor that remains fully pin and signal compatible with PICMG's® COM Express™ Type 1, we can leverage COM Express™ success and use its existing design ecosystem and collateral. The COM Express™ compatible connectors, with their higher EMC, inherently make “Ultra” a future proof design for the small form factor Computer-on-Modules market, says Henk van Bremen, Product Director for ADLINK's Embedded Division.

“Since it is based 100 percent on the pinouts and connector locations used in the already established and proven COM Express™ Type 1 specification, developing a small form factor Computer-on-Module in accordance with the COM Express™ specification is the securest long-term investment,” says Aaron Su, Product Manager of Advantech.

“The support of these three other major Computer-on-Modules vendors underlines the fact that nanoETXexpress is a safe investment . In addition, the market for the COM Express™ Type 1 interconnects is very strong with an expected CAGR of 70% up to 2010 according to VDC. This is why we expect the “Ultra” small Computer-on-Module specification to become the de facto standard for small form factor designs based on Computer-on-Modules,” says Dirk Finstel, CTO of Kontron.

SDVO now available on nanoETXexpress Computer-on-Modules
The small nanoETXexpress Computer-on-Modules offer maximum graphic flexibility as reflected in the new SDVO support. Moreover, they achieve this at a very low cost. Revision 1.0 of the nanoETXexpress Computer-on-Modules specification enables SDVO signal transport via a separate flat foil connector. The LVDS output on the COM Express™ connector can therefore also be retained and used alongside DVI, giving designers the possibility of designing-in extra graphic interfaces on the carrier board to enable dual display solutions.

Revision 1.0 of the nanoETXexpress specification can be downloaded from http://www.nanoetxexpress.com/.
Further embedded computer manufacturers are invited to develop Computer-on-Modules in accordance with the proposed COM Express™ “Ultra” specification. Further details are available at http://www.nanoetxexpress.com/specs/specs.php.