COMe-mSP1 This product is legacy
COM Express® mini Type 1
with Intel® Atom™ Z500 Series
Specifications
- Based on Intel® Atom™ Processor Z5XX and Intel® SCH US15W
- COM Express® mini form factor (55mm x 84mm)
- COM Express® Pin-out Type 1
- Memory and FlashDrive on board
- SerialATA, USB 2.0 and USB Client
This credit card sized COM Express® mini module is compatible to COM Express® pin-out Type 1. On 55 mm x 84 mm footprint COMe-mSP1 is a perfect fit for the next generation of low power, ultra-mobile applications that require energy saving x86 processor performance, high-end graphics, PCI Express and Serial ATA combined with longer battery life. These include handheld devices for medical or multi-media applications, small mobile data systems and a host of new applications that have not previously been possible due to size or power consumption limitations.
The Kontron COM Express® mini COM, COMe-mSP1, is based on the highly-efficient Intel® Atom™ Z5xx processor series and Intel® System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single, space saving chipset design. With only one tenth of the Thermal Design Power and one seventh the size of ULV processors at an identical performance, the COMe-mSP1 COM offers an unprecedented power consumption / performance ratio for x86-based ultra-mobile designs.
The COMe-mSP1 with Flash and memory on-board support 1 PCI Express x1 (opt. 2 x1 if no onboard LAN), Serial ATA, High Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity and 8x USB provides fast and sufficient interfaces for external peripherals.
All above mentioned requirements are supported by COM Express® mini - small power - low size - high performance.
The Kontron COM Express® mini COM, COMe-mSP1, is based on the highly-efficient Intel® Atom™ Z5xx processor series and Intel® System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single, space saving chipset design. With only one tenth of the Thermal Design Power and one seventh the size of ULV processors at an identical performance, the COMe-mSP1 COM offers an unprecedented power consumption / performance ratio for x86-based ultra-mobile designs.
The COMe-mSP1 with Flash and memory on-board support 1 PCI Express x1 (opt. 2 x1 if no onboard LAN), Serial ATA, High Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity and 8x USB provides fast and sufficient interfaces for external peripherals.
All above mentioned requirements are supported by COM Express® mini - small power - low size - high performance.
Features
| CPU | Intel® Atom™ processor Z510 (1.1 GHz) and Z530 (1.6 GHz) |
| Chipset | Intel® System Controller Hub US15W |
| Cache | 32 KB Instruction Cache + 24 KB L1 Cache, 512 KB L2 Cache |
| Main Memory | onBoard up to 2GB DDR2 400/533 |
| USB | 8 x USB 2.0 (1x USB Client) |
| PCI Express / PCI support | 1 x PCI Express x1 Lane (opt. 2 x1 if no onboard LAN) |
| Ethernet | Onboard 10/100/1000 Mbit Intel® LAN |
| Audio Controller | Intel® High Definition Audio |
| Graphics Memory | up to 256 MByte, UMA |
| Graphics Controller | Integrated Intel® Graphics, Intel® GMA 500, HDTV/HD capable, Decoder for MPEG2(HD) / H.264 |
| Resolution | LVDS 18/24bit 1376x768@85Hz SDVO 1920x1080@50Hz (optional) |
| Flash Disk | on Board SSD Flash drive up to 8GByte |
| Interface | SDIO: 1 SDIO port (shared with GPIO) |
| Operating System | Windows® XP SP3, XPe, CE, Linux, VxWorks, QNX |
| Dimensions (H x W x D) | 55 mm x 84 mm |
| Power Consumption | typ. Idle 2,8W - 3,2W @12V |
| Temperature | Operation: 0° to 60°C Storage: -30° to 85°C *Ask about wider temperature ranges |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Compliance | COM Express® (COM.0) Pin Out Type 1 |
| CPU Clock | 1.1 GHz up to 1.6 GHz |
| SM Bus Support | yes |
| USB Boot | yes; |
| Legacy Support | yes |
| Ethernet Controller | Onboard Intel® 82574L Hartwell |
| Power Management | ACPI 2.0 + APM S3 hot and cold support |
| Power Supply | 4,75V – 14V wide range (5V SBY optional for ATX function) |
| Hard Disk | 1x Serial ATA supporting 1.5 GBit/s |
Downloads
Datasheets
Datasheet COMe-mSP1
(Release Candidate)
[ datasheet_come-msp1.pdf, 796.2 KB, Aug.31.2017 ]
Manuals
User's Guide
[ now1m160.pdf, 2.38 MB, Sep.11.2017 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
White Papers
COM Express® Design Guide by PICMG, Rev. 2.0
PICMG Guidelines for designing COM Express® Carrier Boards, Rev. 2.0
[ picmg_comdg_2-0-released-2013-12-06.pdf, 3.27 MB, Apr.20.2023 ]
nanoETXexpress, White Paper Rev. 06.1
White Paper nanoETXexpress, Rev. 06.1
[ nanoetxexpress_whitepaper_rev06-1.pdf, 140.77 KB, Apr.20.2023 ]
nanoETXexpress, Specification Rev. 1.0
Specification for nanoETXexpress, Rev. 1.0
[ nanoetxexpress_specification_rev1-0.pdf-2, 394.82 KB, Apr.20.2023 ]
Technology Paper about COM Express® Concept
Technology Paper about COM Express® Concept - COM Express® - One Concept, Ever Smaller.
[ com_expr_6seiter_11_2011_en_web.pdf, 2.91 MB, Nov.26.2020 ]
nanoETXexpress - QNX Fastboot Whitepaper
Whitepaper nanoETXexpress - QNX fastboot technology - RTOS for x86 nanoETXexpress-SP
[ kontron-qnx-fastboot-whitepaper.pdf, 583.16 KB, Nov.27.2013 ]
nanoETXexpress specification Rev. 2.0
(Release Candidate)
[ nanoetxexpress-specification-rev-2-0.pdf, 313.69 KB, Nov.27.2013 ]
Whitepaper COM Express COM.0 Rev. 2.0
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
HSP COMe-mSP1 thread
34001-0000-99-0 |
Heatspreader 11mm for COMe-mSP1, threaded mounting holes | more | |
|
HSP COMe-mSP1 through 34001-0000-99-1 |
Heatspreader 11mm for COMe-mSP1, through holes | ||
|
HSP COMe-mSP1 slim thread
34001-0000-99-2 |
Slimline heatspreader 6.5mm for COMe-mSP1, threaded mounting holes | more | |
|
HSK COMe-mSP1 slim passive thread 34001-0000-99-0C01 |
Passive cooling solution with slimline HSP for COMe-mSP1, threaded mounting holes | ||
|
COMe mMount Kit 5/8mm 1set 34017-0000-00-0 |
COM Express® Mounting Kit for COMe mini and 5mm/8mm Stand-Off |
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