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IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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Kontron Introduces Smallest ETXexpress® Compatible Footprint
nanoETXexpress Extends the Definition of COM Express to Deliver Versatile, Space-Saving Modules for Future Applications
SAN DIEGO, July 26, 2007 Three years after the 2004 launch of the ETXexpress specification, which has become the PICMG COM Express (COM.0) standard, Kontron defines a new footprint variant of the Computer-On-Modules (COMs) standard: nanoETXexpress.
The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid to high performance x86 technology on a footprint that is a mere 55 mm x 84 mm. This is 39 percent of the original COM Express module Basic form factor 125 x 95 mm footprint and 51 percent of microETXexpress (95mm x 95mm). This new COM form factor follows the PICMG COM Express standard and will be 100 percent compliant with the COM.0 Type 1 connector. The locations of the identically mapped pin-outs will also be 100 percent COM.0 compliant.
The goal of nanoETXexpress specification is to build PCIe-based COMs on the smallest possible form factor. Many new applications that will benefit from the nano-size include hand-held units for medical, mobile data solutions and other emerging applications that have not been possible as of yet due to size restrictions.
The nanoETXexpress specification will provide the ideal footprint for future applications, bearing in mind that forthcoming processor and system-on-chip (SoC) technology will be delivered in 45nm technology and beyond, stated Dirk Finstel, CTO Embedded Modules Division, Kontron.
The specification, documentation for nanoETXexpress will be available under a non-disclosure agreement in Q4 2007. Kontron plans to launch its first nanoETXexpress based COM in Q2 2008.
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About Kontron
Kontron designs and manufactures standard-based and custom embedded and mobile rugged solutions for OEMs, systems integrators, and application providers in a variety of markets. Kontron engineering and manufacturing facilities, located throughout Europe, North America, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontrons diverse product portfolio includes: Computer-on-Modules, SBCs/blades, open-modular platforms and systems, HMIs, mobile rugged workstations, and custom capabilities. Kontron is a Premier member of the Intel® Communications Alliance and was awarded 2006 Intel Member of the Year. The company is a recent three-time VDC Platinum vendor for Embedded Computer Boards. Kontron is listed on the German TecDAX stock exchange under the symbol "KBC". For more information, please visit: www.kontron.com.
Editor Contact
Richard Pugnier
Manager, Marketing Communications
Kontron
858.623.3006
richard.pugnier@us.kontron.com
Product and Technical Contact
Christine Van De Graaf
Product Marketing Manager, Embedded Modules Division
Kontron
510.438.7250
christine.vandegraaf@us.kontron.com
